SCHEMBL274789

SCHEMBL274789

C=CC(=O)OCCOC(=O)CCC(=O)OCC(O)CO

nearest known ligand 0.47

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.47
DUSP3 P51452 1/20 0.47
MEN1 O00255 1/20 0.47
KMT2A Q03164 1/20 0.47
LMNA P02545 1/20 0.47
TSHR P16473 6/20 0.47
ALDH1A1 P00352 4/20 0.47
TP53 P04637 3/20 0.47
HIF1A Q16665 3/20 0.47
HSD17B10 Q99714 1/20 0.47
DGKA P23743 1/20 0.44
CYP3A4 P08684 2/20 0.43
FAAH O00519 4/20 0.43
THRB P10828 2/20 0.41
HPGD P15428 1/20 0.40
CNR2 P34972 2/20 0.39
MAPK1 P28482 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL301192 0.94 KDM4E (0.47) KDM4EDUSP3MEN1KMT2ALMNA
SCHEMBL30106394 0.88 TSHR (0.55) KDM4EDUSP3MEN1KMT2ALMNA
SCHEMBL16689114 0.88 KDM4E (0.43) KDM4EDUSP3MEN1KMT2ALMNA
SCHEMBL3412116 0.83 TSHR (0.53) KDM4EDUSP3MEN1KMT2ALMNA
SCHEMBL115220 0.82 TSHR (0.57) KDM4EDUSP3MEN1KMT2ALMNA
SCHEMBL16002532 0.82 TSHR (0.57) KDM4EDUSP3MEN1KMT2ALMNA
SCHEMBL31040499 0.82 TSHR (0.57) KDM4EDUSP3MEN1KMT2ALMNA
SCHEMBL16666220 0.82 TSHR (0.57) KDM4EDUSP3MEN1KMT2ALMNA
SCHEMBL303596 0.82 TSHR (0.67) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL17119709 0.82 TSHR (0.67) TSHRALDH1A1TP53HIF1AHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9465142-B2 Near-infrared absorptive composition, near-infrared cut filter using near-infrared absorptive composition, method for manufacturing near-infrared cut filter, and camera module and method for manufacturing camera module FUJIFILM CORPORATION (JP) 2016-10-11 US disclosed
US-20150130008-A1 NEAR-INFRARED ABSORPTIVE COMPOSITION, NEAR-INFRARED CUT FILTER USING NEAR-INFRARED ABSORPTIVE COMPOSITION, METHOD FOR MANUFACTURING NEAR-INFRARED CUT FILTER, AND CAMERA MODULE AND METHOD FOR MANUFACTURING CAMERA MODULE FUJIFILM CORPORATION (JP) 2015-05-14 US disclosed
US-8735026-B2 Polymerizable composition, light-blocking color filter for solid-state imaging device, and solid-state imaging device FUJIFILM CORPORATION (JP) 2014-05-27 US disclosed
US-8557948-B2 Photosensitive composition, photosensitive film, photosensitive laminate, method of forming a permanent pattern, and printed board FUJIFILM CORPORATION (JP) 2013-10-15 US disclosed
US-8303860-B2 Colored curable composition, color filter and solid-state imaging device FUJIFILM CORPORATION (JP) 2012-11-06 US disclosed
US-8133654-B2 Laser-decomposable resin composition and laser-decomposable pattern-forming material and flexographic printing plate precursor of laser engraving type using the same FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-20120048594-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, PHOTOSENSITIVE LAMINATE, METHOD OF FORMING A PERMANENT PATTERN, AND PRINTED BOARD FUJIFILM CORPORATION (JP) 2012-03-01 US disclosed
US-20110104596-A1 POLYMERIZABLE COMPOSITION, LIGHT-BLOCKING COLOR FILTER FOR SOLID-STATE IMAGING DEVICE, AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2011-05-05 US disclosed
US-20110017962-A1 COLORED CURABLE COMPOSITION, COLOR FILTER AND SOLID-STATE IMAGING DEVICE FUJIFILM CORPORATION (JP) 2011-01-27 US disclosed
US-20100075118-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2010-03-25 US disclosed
US-20100068470-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD OF PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2010-03-18 US disclosed
US-20090311494-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND PROCESS FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-12-17 US disclosed
US-20090246653-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-7531291-B2 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2009-05-12 US disclosed
US-20090099320-A1 LASER-DECOMPOSABLE RESIN COMPOSITION AND LASER-DECOMPOSABLE PATTERN-FORMING MATERIAL AND FLEXOGRAPHIC PRINTING PLATE PRECURSOR OF LASER ENGRAVING TYPE USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-16 US disclosed
US-7374863-B2 Polyurethane binder, photoinitiator, and acrylic acid; for use as image recording layer of negative lithographic printing plate precursor; drawing with laser light FUJIFILM CORPORATION (JP) 2008-05-20 US disclosed
US-20080057437-A1 heat-decomposable cured polyurethane having an aromatic group is directly connected to a urethane bond; high sensitivity to easily form a pattern FUJIFILM CORPORATION (JP) 2008-03-06 US disclosed