Sugi Predict

Sugi Predict / Compounds / SCHEMBL274971

SCHEMBL274971

SCHEMBL274971

COc1cccc(OC)c1C(=O)P(=S)(c1ccccc1)c1ccccc1

nearest known ligand 0.55

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ CA12 O43570 1/20 0.55
▸ CA1 P00915 1/20 0.55
▸ CA2 P00918 1/20 0.55
▸ CA7 P43166 1/20 0.55
▸ CA9 Q16790 1/20 0.55
▸ CA14 Q9ULX7 1/20 0.55
▸ TAAR1 Q96RJ0 1/20 0.43
▸ ALDH1A1 P00352 1/20 0.43
▸ GAA P10253 1/20 0.43
▸ HTT P42858 2/20 0.41
▸ L3MBTL1 Q9Y468 1/20 0.41
▸ POLB P06746 1/20 0.41
▸ SMN1; SMN2 Q16637 1/20 0.41
▸ KMT2A Q03164 2/20 0.40
▸ ESR1 P03372 1/20 0.40
▸ ESR2 Q92731 1/20 0.40
▸ PPARA Q07869 1/20 0.39
▸ LMNA P02545 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5144083 0.87 CA12 (0.55) CA12CA1CA2CA7CA9
SCHEMBL10955172 0.86 CA12 (0.46) CA12CA1CA2CA7CA9
SCHEMBL10953847 0.86 KMT2A (0.46) ALDH1A1SMN1; SMN2KMT2ALMNA
SCHEMBL7862158 0.81 CA12 (0.56) CA12CA1CA2CA7CA9
SCHEMBL247258 0.81 CA12 (0.56) CA12CA1CA2CA7CA9
SCHEMBL68471 0.81 CA12 (0.56) CA12CA1CA2CA7CA9
SCHEMBL8668470 0.80 CA12 (0.59) CA12CA1CA2CA7CA9
SCHEMBL2703815 0.80 CA12 (0.55) CA12CA1CA2CA7CA9
SCHEMBL68740 0.80 CA12 (0.55) CA12CA1CA2CA7CA9
Phosphine SCHEMBL28206448 0.80 CA12 (0.55) CA12CA1CA2CA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 118 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2109000-B1 Polymer having polymerizable group, polymerizable composition, planographic printing plate precursor, and planographic printing method using the same FUJIFILM CORP (JP) 2017-02-22 — — EP disclosed
EP-1403710-B1 Polymerizable composition FUJIFILM CORP (JP) 2015-06-10 — — EP disclosed
EP-2085220-B1 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORP (JP) 2015-05-20 — — EP disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 — — US disclosed
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 — — US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 — — US disclosed
US-8669040-B2 Method of manufacturing relief printing plate and printing plate precursor for laser engraving FUJIFILM CORPORATION (JP) 2014-03-11 — — US disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 — — US disclosed
US-8389198-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-03-05 — — US disclosed
US-8361702-B2 Resin composition for laser engraving, resin printing plate precursor for laser engraving, relief printing plate and method for production of relief printing plate FUJIFILM CORPORATION (JP) 2013-01-29 — — US disclosed
EP-1839853-A1 Planographic printing plate precursor and stack thereof FUJIFILM Corporation (JP) 2007-10-03 — — EP disclosed
US-20070212883-A1 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material FUJIFILM CORPORATION (JP) 2007-09-13 — — US disclosed
US-20070212883-A1 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material FUJIFILM CORPORATION (JP) 2007-09-13 — — US disclosed
US-7232644-B2 Polymerizable composition and negative-working planographic printing plate precursor using the same FUJIFILM CORPORATION (JP) 2007-06-19 — — US disclosed
US-7232644-B2 Polymerizable composition and negative-working planographic printing plate precursor using the same FUJIFILM CORPORATION (JP) 2007-06-19 — — US disclosed
US-20070072113-A1 Photosensitive composition, and lithographic printing plate precursor and image-recording method using the same FUJI PHOTO FILM CO., LTD. 2007-03-29 — — US disclosed
US-20070072113-A1 Photosensitive composition, and lithographic printing plate precursor and image-recording method using the same FUJI PHOTO FILM CO., LTD. 2007-03-29 — — US disclosed
US-7179582-B2 Radical polymerizable composition and lithographic printing plate precursor using the same FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 — — US disclosed
US-7179582-B2 Radical polymerizable composition and lithographic printing plate precursor using the same FUJI PHOTO FILM CO., LTD. (JP) 2007-02-20 — — US disclosed
US-4522693-A Photopolymerizable composition with acylphosphine sulfide photoinitiator and method BASF AKTIENGESELLSCHAFT (DE) 1985-06-11 — — US disclosed