SCHEMBL27519652

SCHEMBL27519652

O=C1C=CC(=O)N1.O=C1C=CC(=O)N1.c1cnnnc1.c1cnnnc1

nearest known ligand 0.58

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
GSK3A P49840 1/20 0.58
GSK3B P49841 1/20 0.58
CCR6 P51684 1/20 0.58

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL35904 1.00 GSK3A (0.58) GSK3AGSK3BCCR6
SCHEMBL1706736 1.00 GSK3A (0.58) GSK3AGSK3BCCR6
Benzene SCHEMBL27578075 0.97 GSK3A (0.55) GSK3AGSK3BCCR6
Cyanate SCHEMBL28068603 0.87 GSK3A (0.44) GSK3AGSK3BCCR6
SCHEMBL12487731 0.86 GSK3A (0.61) GSK3AGSK3BCCR6
SCHEMBL27796563 0.81 GSK3A (0.38) GSK3AGSK3BCCR6
Benzene SCHEMBL28786769 0.76 GSK3B (0.85) GSK3AGSK3BCCR6
Hydrochloric Acid SCHEMBL377589 0.76
SCHEMBL33524954 0.76
SCHEMBL715867 0.76 GSK3B (1.00) GSK3AGSK3BCCR6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118248561-A Manufacturing method for multilayer organic packaging substrate 强一半导体(上海)有限公司 2024-06-25 CN disclosed
CN-117998729-A Embedded device packaging substrate and manufacturing method thereof 南通越亚半导体有限公司 2024-05-07 CN disclosed
CN-208507723-U A kind of four color light source wiring boards for LED encapsulation 山西高科华兴电子科技有限公司 2019-02-15 CN disclosed
CN-108470815-A The four color light source wiring boards for LED encapsulation 山西高科华兴电子科技有限公司 2018-08-31 CN disclosed
CN-204291575-U Stacking type encapsulation printed circuit board (PCB) AZUREWAVE TECHNOLOGY SHANGHAI CO LTD 2015-04-22 CN disclosed
CN-101252108-A Semiconductor device package having die receiving via and connecting via and method thereof ADVANCED CHIP ENG TECH INC (CN) 2008-08-27 CN disclosed
CN-100370603-C Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment SEIKO EPSON CORP (JP) 2008-02-20 CN disclosed
CN-1235375-A Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment SEIKO EPSON CORP (JP) 1999-11-17 CN disclosed