Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 5/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
| ▸ | PKM | P14618 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4752092 | 0.75 | CYP2C19 (0.39) | CYP2C19 | |
| SCHEMBL28432962 | 0.69 | KDM4E (0.36) | KDM4ETDP1CYP2C19ALDH1A1HSD17B10 | |
| SCHEMBL11270734 | 0.68 | CYP2C19 (0.35) | CYP2C19 | |
| SCHEMBL11124526 | 0.67 | CYP2C19 (0.34) | CYP2C19 | |
| SCHEMBL14022592 | 0.66 | — | — | |
| SCHEMBL628623 | 0.66 | — | — | |
| SCHEMBL521972 | 0.66 | — | — | |
| SCHEMBL7873210 | 0.66 | — | — | |
| SCHEMBL10516170 | 0.66 | — | — | |
| SCHEMBL28353604 | 0.66 | KDM4E (0.36) | KDM4ETDP1CYP2C19ALDH1A1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-101087772-B | High-purity alicyclic diepoxy compound and preparation method thereof | DAICEL CHEM | 2012-05-09 | — | — | CN | disclosed |
| CN-1934098-B | High-purity alicyclic epoxy compound, process for producing the same, curable epoxy resin composition, cured article thereof, and use | DAICEL CHEM | 2012-04-25 | — | — | CN | disclosed |
| CN-1934098-A | High-purity alicyclic epoxy compound, process for producing the same, curable epoxy resin composition, cured article thereof, and use | DAICEL CHEM (JP) | 2007-03-21 | — | — | CN | disclosed |