⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28913663 | 1.00 | — | — | |
| SCHEMBL336845 | 0.97 | — | — | |
| SCHEMBL135427 | 0.97 | — | — | |
| SCHEMBL27584511 | 0.97 | — | — | |
| SCHEMBL9299267 | 0.93 | — | — | |
| SCHEMBL38652630 | 0.93 | — | — | |
| SCHEMBL7631764 | 0.93 | — | — | |
| SCHEMBL1627307 | 0.93 | — | — | |
| SCHEMBL31264925 | 0.93 | — | — | |
| SCHEMBL31138842 | 0.93 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106415829-A | Protective via cap for improved interconnect performance | 应用材料公司 | 2017-02-15 | — | — | CN | disclosed |
| CN-103215570-A | Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film | APPLIED MATERIALS INC | 2013-07-24 | — | — | CN | disclosed |
| CN-101438391-B | Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric films | APPLIED MATERIALS INC | 2013-04-10 | — | — | CN | disclosed |
| CN-101466863-B | Process for forming cobalt-containing materials | APPLIED MATERIALS INC | 2011-08-10 | — | — | CN | disclosed |
| CN-101466863-A | Process for forming cobalt-containing materials | APPLIED MATERIALS INC (US) | 2009-06-24 | — | — | CN | disclosed |
| CN-101438391-A | Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric films | APPLIED MATERIALS INC (US) | 2009-05-20 | — | — | CN | disclosed |