SCHEMBL277963

SCHEMBL277963

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nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5822349 0.87
SCHEMBL8941777 0.87
SCHEMBL29435147 0.82
SCHEMBL18204297 0.82
SCHEMBL30504199 0.82
SCHEMBL30504201 0.82
SCHEMBL82413 0.82
SCHEMBL862074 0.82
SCHEMBL9690693 0.82
SCHEMBL30776846 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 176 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115458720-B Fibrous knitting wool-based flexible zinc battery and preparation method and application thereof 暨南大学 2025-04-11 CN claimed
CN-114525534-A Active electrolytic water electrode and preparation method and application thereof 中国科学院大连化学物理研究所 2022-05-24 CN claimed
CN-106827553-B It is a kind of with the ultralight of X-ray shielding properties, ultrathin flexible nano metal/nano-fiber composite film and preparation method thereof 吉林省贞靓科技有限公司 2019-07-09 CN claimed
CN-109137488-A A kind of cobalt-iron-phosphorus non-crystalline alloy/polymer composite fibrous and production method 刘志红 2019-01-04 CN claimed
CN-106827553-A A kind of ultralight, ultrathin flexible nano metal/nano-fiber composite film with X alpha ray shield performances and preparation method thereof 盐城迈迪科技有限公司 2017-06-13 CN claimed
CN-115458720-B Fibrous knitting wool-based flexible zinc battery and preparation method and application thereof 暨南大学 2025-04-11 CN disclosed
WO-2024122893-A1 COPPER FOIL ATTACHED TO CARRIER FOIL AND COPPER CLAD LAMINATE USING SAME 롯데에너지머티리얼즈 주식회사 2024-06-13 WO disclosed
CN-117917194-A Ultra-thin copper foil with carrier foil for allowing simple micro-hole processing, copper-clad laminate using the same, and method for manufacturing the same 乐天能源材料公司 2024-04-19 CN disclosed
US-11917755-B2 Carrier-foil-attached ultra-thin copper foil LOTTE ENERGY MATERIALS CORPORATION (KR) 2024-02-27 US disclosed
US-20230413577-A1 Multilayered Seed for Perpendicular Magnetic Structure Including an Oxide Layer AVALANCHE TECHNOLOGY, INC. 2023-12-21 US disclosed
US-20230403945-A1 Magnetic Memory Element Including Perpendicular Enhancement Layers and Dual Oxide Cap Layers AVALANCHE TECHNOLOGY, INC. 2023-12-14 US disclosed
US-11785784-B2 Multilayered seed for perpendicular magnetic structure including an oxide layer AVALANCHE TECHNOLOGY, INC. (US) 2023-10-10 US disclosed
US-20050249927-A1 ultra-thin foil with a carrier that enables a production of a clad laminated board from a resin substrate which requires casting or pressing at a high temperature, and enables a process of drilling holes by CO2 laser directly through the foil CIRCUIT FOIL JAPAN CO., LTD. (JP) 2005-11-10 US disclosed
US-20050233593-A1 Plating of multi-layer structures UNIVERSITY COLLEGE CORK-NATIONAL UNIVERSITY OF IRELAND, CORK (IE) 2005-10-20 US disclosed
US-20040038049-A1 Release layer, a diffusion preventive layer and a copper electroplating layer; printed circuits CIRCUIT FOIL JAPAN CO., LTD. (JP) 2004-02-26 US disclosed
EP-1143774-B1 Wiring board comprising granular magnetic film NEC TOKIN CORP (JP) 2004-01-14 EP disclosed
CN-1466517-A Copper foil for high-density ultrafine wiring board �źӵ�·ͭ����ʽ���� 2004-01-07 CN disclosed
EP-1331088-A1 COPPER FOIL FOR HIGH-DENSITY ULTRAFINE WIRING BOARD Circuit Foil Japan Co. Ltd (JP) 2003-07-30 EP disclosed
EP-0736369-A1 METALLIZED FIBER-REINFORCED RESIN ROLL AND PRODUCTION THEREOF SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1996-10-09 EP disclosed
US-5435903-A Acidity for workable alloy, reducing agents and complexing agents for magnetic alloy MITSUBISHI RAYON COMPANY, LTD. (JP) 1995-07-25 US disclosed