SCHEMBL27799556

SCHEMBL27799556

C(=CC1CC(c2cccs2)=NN1c1ccccc1)c1ccccc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ATM Q13315 8/20 0.61
▸ MEN1 O00255 8/20 0.61
▸ KMT2A Q03164 8/20 0.61
▸ KDM4E B2RXH2 7/20 0.61
▸ MAPT P10636 7/20 0.61
▸ L3MBTL1 Q9Y468 7/20 0.61
▸ GLA P06280 6/20 0.61
▸ TDP1 Q9NUW8 6/20 0.61
▸ MAPK1 P28482 6/20 0.61
▸ POLB P06746 1/20 0.61
▸ ALDH1A1 P00352 7/20 0.55
▸ GAA P10253 6/20 0.55
▸ LMNA P02545 4/20 0.55
▸ SMN1; SMN2 Q16637 3/20 0.55
▸ HPGD P15428 4/20 0.54
▸ RECQL P46063 1/20 0.54
▸ S1PR4 O95977 3/20 0.52
▸ S1PR1 P21453 3/20 0.52
▸ RXFP1 Q9HBX9 2/20 0.52
▸ NPSR1 Q6W5P4 1/20 0.52

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27778487 0.89 MEN1 (0.67) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL27799547 0.86 MEN1 (0.49) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL9152437 0.81 EGFR (0.60) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL28427927 0.76 ATM (1.00) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL27842552 0.75 KDM4E (0.77) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL10022724 0.74 EGFR (0.45) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL2688378 0.74 EGFR (0.49) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL11224234 0.72 MAPT (0.42) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL27778546 0.70 MEN1 (0.47) ATMMEN1KMT2AKDM4EMAPT
SCHEMBL19471300 0.70 KDM4E (1.00) ATMMEN1KMT2AKDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102375341-B The manufacture method of photosensitive polymer combination, element, resist figure and lead frame, printed-wiring board (PWB) and manufacture method thereof HITACHI CHEMICAL CO., LTD. (JP) 2016-04-06 — — CN disclosed
CN-104808444-A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same HITACHI CHEMICAL CO LTD 2015-07-29 — — CN disclosed
CN-103543608-A Photosensitive resin composition, and photosensitive element, resist pattern formation method and printed circuit board production method each utilizing same HITACHI CHEMICAL CO LTD 2014-01-29 — — CN disclosed
CN-101679393-B Fluorescent material NIPPON CHEMICAL WORKS 2012-12-12 — — CN disclosed
CN-102375341-A Manufacturing Method Of Photosensitive Resin Composite, Element And Slushing Compound Pattern, Manufacturing Method Of Lead Frame And Printed Circuit Board HITACHI CHEMICAL CO LTD 2012-03-14 — — CN disclosed
CN-102317864-A Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2012-01-11 — — CN disclosed
CN-101679393-A Fluorescent material NIPPON CHEMICAL WORKS 2010-03-24 — — CN disclosed
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