Edetol

Edetol

SCHEMBL2803498

CC(O)CN(CCN(CC(C)O)CC(C)O)CC(C)O.CC(O)CN(CCN(CC(C)O)CC(C)O)CC(C)O

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Full drug profile on Sugi Atlas →

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.39
TDP1 Q9NUW8 1/20 0.39
KDM4E B2RXH2 1/20 0.39
ALDH1A1 P00352 2/20 0.37
RECQL P46063 1/20 0.36
KMT2A Q03164 1/20 0.32
ATM Q13315 1/20 0.32
LMNA P02545 1/20 0.31
CA12 O43570 1/20 0.31
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
CA9 Q16790 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Edetol SCHEMBL48412 1.00 TSHR (0.39) TSHRTDP1KDM4EALDH1A1RECQL
Edetol SCHEMBL30689143 0.97 KDM4E (0.38) TSHRTDP1KDM4EALDH1A1RECQL
Edetol SCHEMBL20942798 0.97 KDM4E (0.38) TSHRTDP1KDM4EALDH1A1RECQL
Edetol SCHEMBL17728141 0.97 KDM4E (0.38) TSHRTDP1KDM4EALDH1A1RECQL
Edetol SCHEMBL3634484 0.97 KDM4E (0.38) TSHRTDP1KDM4EALDH1A1RECQL
SCHEMBL6260966 0.97 KDM4E (0.38) TSHRTDP1KDM4EALDH1A1RECQL
SCHEMBL9785645 0.97 KDM4E (0.38) TSHRTDP1KDM4EALDH1A1RECQL
Edetol SCHEMBL8989695 0.97 KDM4E (0.38) TSHRTDP1KDM4EALDH1A1RECQL
SCHEMBL1446865 0.97 KDM4E (0.38) TSHRTDP1KDM4EALDH1A1RECQL
SCHEMBL9641757 0.91 CYP1A2 (0.39) TSHRTDP1KDM4EALDH1A1RECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9869026-B2 Electroless copper plating compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-01-16 US disclosed
US-20160017498-A1 ELECTROLESS COPPER PLATING COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC 2016-01-21 US disclosed
US-7732382-B2 Cross-linking composition and method of use E.I. DU PONT DE NEMOURS AND COMPANY (US) 2010-06-08 US disclosed
US-7527681-B2 Electroless copper and redox couples ROHM AND HAAS ELECTRONIC MATERIALS LLP (US) 2009-05-05 US disclosed
US-20080038449-A1 Electroless copper and redox couples ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-02-14 US disclosed
US-20080038451-A1 Formaldehyde free electroless copper compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-02-14 US disclosed
US-20080038450-A1 Environmentally friendly electroless copper compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-02-14 US disclosed
WO-2007095367-A2 CROSS-LINKING COMPOSITION AND METHOD OF USE E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-08-23 WO disclosed
US-20070187098-A1 Permeable zone and leak plugging using cross-linking composition comprising delay agent E. I. DU PONT DE NEMOURS AND COMPANY 2007-08-16 US disclosed
US-20070187102-A1 Hydraulic fracturing methods using cross-linking composition comprising delay agent E. I. DU PONT DE NEMOURS AND COMPANY 2007-08-16 US disclosed
US-20070191233-A1 Cross-linking composition and method of use DORF KETAL SPECIALITY CATALYSTS, LLC 2007-08-16 US disclosed
US-5340900-A Hardener composition for the production of polyurethane shaped articles CIBA-GEIGY CORPORATION (US) 1994-08-23 US disclosed