SCHEMBL2805168

SCHEMBL2805168

CCO[SiH2]OCC.[H+].[H+]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28058989 1.00
SCHEMBL109023 0.96
Fluoride SCHEMBL28303577 0.92
Ethane SCHEMBL29126000 0.92
Methane SCHEMBL1116289 0.92
Bromide SCHEMBL9709858 0.92
SCHEMBL10455387 0.92
SCHEMBL5961099 0.92
Water SCHEMBL28241835 0.92
Hydrochloric Acid SCHEMBL10570728 0.92

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8440775-B2 Curable liquid composition, method of coating, inorganic substrate, and semiconductor device DOW CORNING CORPORATION (US) 2013-05-14 US claimed
US-20100089451-A1 Curable Liquid Composition, Method Of Coating, Inorganic Substrate, and Semiconductor Device DOW CORNING TORAY COMPANY, LTD. (JP) 2010-04-15 US claimed
US-8440775-B2 Curable liquid composition, method of coating, inorganic substrate, and semiconductor device DOW CORNING CORPORATION (US) 2013-05-14 US disclosed
US-20100089451-A1 Curable Liquid Composition, Method Of Coating, Inorganic Substrate, and Semiconductor Device DOW CORNING TORAY COMPANY, LTD. (JP) 2010-04-15 US disclosed
EP-2118175-A2 CURABLE LIQUID COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE, AND SEMICONDUCTOR DEVICE Dow Corning Toray Co., Ltd. (JP) 2009-11-18 EP disclosed
WO-2008099767-A2 CURABLE LIQUID COMPOSITION, METHOD OF COATING, INORGANIC SUBSTRATE, AND SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2008-08-21 WO disclosed