⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23795 | 1.00 | — | — | |
| SCHEMBL8985740 | 0.96 | — | — | |
| SCHEMBL7640617 | 0.96 | — | — | |
| Hydrochloric Acid SCHEMBL6795047 | 0.96 | — | — | |
| SCHEMBL23045254 | 0.96 | — | — | |
| 1-Propanethiol SCHEMBL23668530 | 0.96 | — | — | |
| Methane SCHEMBL4634054 | 0.96 | — | — | |
| Ammonia Solution, Strong SCHEMBL14335643 | 0.96 | — | — | |
| SCHEMBL21060807 | 0.96 | — | — | |
| Butane SCHEMBL5390235 | 0.96 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105182687-B | Non- roasting conductive resin composition and conducting channel | 太阳油墨制造株式会社 | 2019-11-15 | — | — | CN | disclosed |
| CN-104345561-B | Conductive resin composition and its solidfied material | 太阳油墨制造株式会社 | 2018-04-13 | — | — | CN | disclosed |
| CN-104035280-B | Photosensitive polymer combination, its cured film and printed circuit board (PCB) | 太阳油墨制造株式会社 | 2017-10-24 | — | — | CN | disclosed |
| CN-102822284-B | Curable resin composition, dry film using same, and printed wiring board | 太阳控股株式会社 | 2017-02-22 | — | — | CN | disclosed |
| CN-106019834-A | Conductive resin composition and conductive circuit | 太阳油墨制造株式会社 | 2016-10-12 | — | — | CN | disclosed |
| CN-103135352-B | Conductive resin composition and conductive circuit | 太阳油墨制造株式会社 | 2016-09-21 | — | — | CN | disclosed |
| CN-105807564-A | Light curing and heat curing resin composition, cured substance and printed circuit board | 太阳油墨（苏州）有限公司 | 2016-07-27 | — | — | CN | disclosed |
| CN-105739239-A | Photocurable and thermosetting resin composition, dry film, cured material and printed circuit board | 太阳油墨（苏州）有限公司 | 2016-07-06 | — | — | CN | disclosed |