SCHEMBL2805835

SCHEMBL2805835

C=COC(=O)C1=CCCCC1

nearest known ligand 0.47

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HDAC2 Q92769 4/20 0.47
HDAC4 P56524 2/20 0.47
HDAC8 Q9BY41 2/20 0.47
HDAC6 Q9UBN7 2/20 0.47
HDAC1 Q13547 3/20 0.40
HDAC3 O15379 2/20 0.40
HDAC7 Q8WUI4 1/20 0.40
HDAC5 Q9UQL6 1/20 0.40
CTSK P43235 1/20 0.39
GSTP1 P09211 1/20 0.36
CCR2 P41597 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL247223 0.84
SCHEMBL28109625 0.79 HDAC2 (0.44) HDAC2HDAC4HDAC8HDAC6HDAC1
SCHEMBL6968662 0.79 HDAC2 (0.52) HDAC2HDAC4HDAC8HDAC6HDAC1
SCHEMBL8429199 0.78 HDAC2 (0.55) HDAC2HDAC4HDAC8HDAC6HDAC1
SCHEMBL8602285 0.77 CYP3A4 (0.46) HDAC2HDAC4HDAC8HDAC6HDAC1
SCHEMBL6756320 0.77 HDAC4 (0.41) HDAC2HDAC4HDAC8HDAC6HDAC1
SCHEMBL4022755 0.76 HDAC2 (0.53) HDAC2HDAC4HDAC8HDAC6HDAC1
SCHEMBL27029393 0.76 HDAC2 (0.53) HDAC2HDAC4HDAC8HDAC6HDAC1
Trimethylammonium SCHEMBL27963925 0.75 HDAC4 (0.41) HDAC2HDAC4HDAC8HDAC6HDAC1
SCHEMBL15827638 0.75 HDAC2 (0.52) HDAC2HDAC4HDAC8HDAC6HDAC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8449100-B2 Inkjet recording method FUJIFILM CORPORATION (JP) 2013-05-28 US disclosed
US-20100238246-A1 INKJET RECORDING METHOD FUJIFILM CORPORATION (JP) 2010-09-23 US disclosed
US-7465533-B2 Photothermographic material and an image forming method FUJIFILM CORPORPORATION (JP) 2008-12-16 US disclosed
US-7407741-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2008-08-05 US disclosed
US-7396639-B2 Photothermographic material and image forming method FUJIFILM CORPORATION (JP) 2008-07-08 US disclosed
US-7279273-B2 Photothermographic material FUJIFILM CORPORATION (JP) 2007-10-09 US disclosed
US-20070178417-A1 Photothermographic material and an image forming method FUJIFILM CORPORATION (JP) 2007-08-02 US disclosed
US-20070082303-A1 Silver salt particle of nitrogen-containing heterocyclic compound and photothermographic material containing the same FUJI PHOTO FILM CO., LTD. 2007-04-12 US disclosed
US-20070082301-A1 Image forming method using photothermographic material FUJI PHOTO FILM CO., LTD. 2007-04-12 US disclosed
US-20070072135-A1 Photothermographic material FUJI PHOTO FILM CO., LTD. 2007-03-29 US disclosed
US-20070031766-A1 Photothermographic material FUJI PHOTO FILM CO., LTD. 2007-02-08 US disclosed
US-7166408-B2 Image forming method using photothermographic material FUJIFILM CORPORATION (JP) 2007-01-23 US disclosed
US-20060292503-A1 Photothermographic material and image forming method FUJI PHOTO FILM CO., LTD. 2006-12-28 US disclosed
US-20060073429-A1 Photothermographic material FUJIFILM CORPORATION (JP) 2006-04-06 US disclosed
US-20050260529-A1 Image forming method using photothermographic material FUJIFILM CORPORATION (JP) 2005-11-24 US disclosed
CN-1032537-C Process for preparing organosilicon compounds containing epoxy groups WACKER CHEMIE GMBH (DE) 1996-08-14 CN disclosed
CN-1069980-A Preparation contains the method for the silicoorganic compound of epoxy group(ing) WACKER CHEMIE GMBH (DE) 1993-03-17 CN disclosed