Formaldehyde

Formaldehyde

SCHEMBL28060910

C=O.Clc1cncc(Cl)c1

nearest known ligand 0.52

Full drug profile on Sugi Atlas →

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 1/20 0.52
CHRNB2 P17787 4/20 0.43
CHRNA4 P43681 4/20 0.43
TSHR P16473 1/20 0.41
CHRNB4 P30926 1/20 0.41
CHRNA3 P32297 1/20 0.41
MKNK1 Q9BUB5 1/20 0.41
MKNK2 Q9HBH9 1/20 0.41
CHRNA1 P02708 1/20 0.38
CHRNA7 P36544 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL197638 0.90
SCHEMBL28044800 0.87
Water SCHEMBL28044737 0.87
Hydrochloric Acid SCHEMBL6069542 0.87
SCHEMBL30129770 0.87
SCHEMBL28151623 0.85 HCAR2 (0.50) HCAR2CHRNB2CHRNA4TSHRCHRNB4
Water SCHEMBL28044696 0.84 HCAR2 (0.48) HCAR2CHRNB2CHRNA4TSHRCHRNB4
SCHEMBL29111879 0.82 HCAR2 (0.60) HCAR2CHRNB2CHRNA4CHRNB4CHRNA3
Formaldehyde SCHEMBL28841438 0.82 HCAR2 (0.43) HCAR2CHRNB2CHRNA4CHRNB4CHRNA3
Formaldehyde SCHEMBL28184486 0.82 HCAR2 (0.43) HCAR2CHRNB2CHRNA4CHRNB4CHRNA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116063283-A 3-amino indazole compound and application thereof 暨南大学 2023-05-05 CN disclosed
CN-108699065-A Tricyclic compounds and composition as kinase inhibitor 诺华股份有限公司 2018-10-23 CN disclosed
CN-106317023-A Preparation method and application of indazole compound 中国科学院上海药物研究所 2017-01-11 CN disclosed
CN-105585558-A Double-alkoxy pyrimidine jointing 3-ethylenic-bond-oxoindole derivative and preparing method and application thereof UNIV GUIZHOU 2016-05-18 CN disclosed