SCHEMBL28071098

SCHEMBL28071098

O=C(Cc1ccccc1)Oc1ccccc1.[Ag]

nearest known ligand 0.73

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.73
KMT2A Q03164 4/20 0.59
HPGD P15428 2/20 0.59
SMN1; SMN2 Q16637 1/20 0.58
L3MBTL1 Q9Y468 2/20 0.57
ALDH1A1 P00352 1/20 0.57
MAPK1 P28482 1/20 0.57
PAM P19021 1/20 0.55
TSHR P16473 1/20 0.53
ASAH1 Q13510 1/20 0.53
CES2 O00748 1/20 0.52
CES1 P23141 1/20 0.52
AKR1B1 P15121 1/20 0.52
UCHL1 P09936 1/20 0.50
USP5 P45974 1/20 0.50
USP4 Q13107 1/20 0.50
SENP1 Q9P0U3 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL538524 0.98 CYP19A1 (0.76) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL11131614 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL27858506 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL28035668 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL4205339 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL8365863 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL28795788 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL27841007 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL11759023 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1
SCHEMBL27858507 0.96 CYP19A1 (0.73) CYP19A1KMT2AHPGDSMN1; SMN2L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105814090-B Compound, hot curing resin composition and Thermocurable sheet material 迪睿合株式会社 2018-06-26 CN disclosed
CN-105814090-A Compound, heat-curable resin composition, and heat-curable sheet 迪睿合株式会社 2016-07-27 CN disclosed