Diphenylacetic Acid

Diphenylacetic Acid

SCHEMBL28071099

O=C(O)C(c1ccccc1)c1ccccc1.[Ag]

nearest known ligand 0.59

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SRC P12931 2/20 0.59
CYP2D6 P10635 1/20 0.59
TDP1 Q9NUW8 1/20 0.58
L3MBTL1 Q9Y468 1/20 0.58
LMNA P02545 3/20 0.56
MAPK1 P28482 1/20 0.56
HDAC3 O15379 1/20 0.56
HDAC4 P56524 1/20 0.56
HDAC1 Q13547 1/20 0.56
HDAC7 Q8WUI4 1/20 0.56
HDAC2 Q92769 1/20 0.56
HDAC10 Q969S8 1/20 0.56
HDAC11 Q96DB2 1/20 0.56
HDAC8 Q9BY41 1/20 0.56
HDAC6 Q9UBN7 1/20 0.56
HDAC9 Q9UKV0 1/20 0.56
HDAC5 Q9UQL6 1/20 0.56
CTSD P07339 1/20 0.54
POLB P06746 1/20 0.52
CES2 O00748 2/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Diphenylacetic Acid SCHEMBL38022 0.97 SRC (0.62) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL8513250 0.97 SRC (0.62) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL9750917 0.94 SRC (0.59) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL28446280 0.94 SRC (0.59) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL30803718 0.94 SRC (0.59) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL8411440 0.94 SRC (0.59) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL6852183 0.94 SRC (0.59) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL9485695 0.94 SRC (0.59) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL418537 0.94 SRC (0.59) SRCCYP2D6TDP1L3MBTL1LMNA
Diphenylacetic Acid SCHEMBL27858509 0.94 SRC (0.59) SRCCYP2D6TDP1L3MBTL1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105814090-B Compound, hot curing resin composition and Thermocurable sheet material 迪睿合株式会社 2018-06-26 CN disclosed
CN-105814090-A Compound, heat-curable resin composition, and heat-curable sheet 迪睿合株式会社 2016-07-27 CN disclosed