SCHEMBL28071834

SCHEMBL28071834

C(OCC1CO1)C1CO1.Oc1c(O)c(-c2c(F)c(F)c(F)c(F)c2F)c(F)c(F)c1F

nearest known ligand 0.38

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.38
ALDH1A1 P00352 2/20 0.35
MAPK1 P28482 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.34
TDP1 Q9NUW8 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28188930 0.74 TSHR (0.34) TSHRALDH1A1MAPK1SMN1; SMN2TDP1
SCHEMBL3396112 0.72
SCHEMBL9861678 0.70 TSHR (0.46) TSHRALDH1A1MAPK1SMN1; SMN2TDP1
Hydrogen Peroxide SCHEMBL27921718 0.70 TSHR (0.62) TSHRALDH1A1MAPK1SMN1; SMN2TDP1
SCHEMBL4486338 0.70 TSHR (0.62) TSHRALDH1A1MAPK1SMN1; SMN2TDP1
SCHEMBL4623846 0.69
SCHEMBL15245 0.69
SCHEMBL2933671 0.69
SCHEMBL2933673 0.69
SCHEMBL4895623 0.69 TSHR (0.68) TSHRALDH1A1MAPK1SMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115946411-A High-thermal-conductivity copper-clad plate and preparation process thereof 昆山倬跃蓝天电子科技有限公司 2023-04-11 CN claimed
CN-105711198-B A kind of anti-skidding coiled material of automatically cleaning and preparation method thereof 浙江港流高分子科技有限公司 2017-09-12 CN claimed
CN-105711198-A Self-cleaning antiskid coiled material and preparation method thereof 浙江港流高分子科技有限公司 2016-06-29 CN claimed
CN-113817138-B UV-cured high-fluorine-content anti-fingerprint resin and preparation method and application thereof 长沙松润新材料有限公司 2024-10-01 CN disclosed
CN-117820637-A Photo-curing water dispersion, preparation method and application thereof 南雄市沃太化工有限公司 2024-04-05 CN disclosed
CN-115946411-A High-thermal-conductivity copper-clad plate and preparation process thereof 昆山倬跃蓝天电子科技有限公司 2023-04-11 CN disclosed
CN-105711198-B A kind of anti-skidding coiled material of automatically cleaning and preparation method thereof 浙江港流高分子科技有限公司 2017-09-12 CN disclosed
CN-107129650-A A kind of grave protection material and preparation method 深圳福帝宝生物技术有限公司 2017-09-05 CN disclosed
CN-105711198-A Self-cleaning antiskid coiled material and preparation method thereof 浙江港流高分子科技有限公司 2016-06-29 CN disclosed