Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 5/20 | 0.50 |
| ▸ | THRB | P10828 | 1/20 | 0.50 |
| ▸ | DNM1 | Q05193 | 6/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.38 |
| ▸ | LMNA | P02545 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.38 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.38 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Cyclopentane SCHEMBL28232497 | 1.00 | TSHR (0.50) | TSHRTHRBDNM1ALDH1A1LMNA | |
| Cyclohexane SCHEMBL28133802 | 1.00 | TSHR (0.50) | TSHRTHRBDNM1ALDH1A1LMNA | |
| Cyclopentane SCHEMBL28323497 | 1.00 | TSHR (0.50) | TSHRTHRBDNM1ALDH1A1LMNA | |
| Cyclopentane SCHEMBL28103662 | 1.00 | TSHR (0.50) | TSHRTHRBDNM1ALDH1A1LMNA | |
| Cyclopentane SCHEMBL28164763 | 0.97 | TSHR (0.44) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL144689 | 0.90 | TSHR (0.61) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL199711 | 0.90 | TSHR (0.61) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL1878825 | 0.90 | TSHR (0.61) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL3056 | 0.90 | TSHR (0.61) | TSHRTHRBDNM1ALDH1A1LMNA | |
| SCHEMBL158879 | 0.90 | TSHR (0.61) | TSHRTHRBDNM1ALDH1A1LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109971122-A | Epoxy resin molding material for encapsulation and electronic part apparatus | 日立化成株式会社 | 2019-07-05 | — | — | CN | disclosed |
| CN-108699408-A | Adhesive film for multilayer printed wiring board | 日立化成株式会社 | 2018-10-23 | — | — | CN | disclosed |
| CN-103214853-B | Heat conductive organic silicon composition and cured compound thereof | 信越化学工业株式会社 | 2017-04-12 | — | — | CN | disclosed |
| CN-106200263-A | Photosensitive polymer combination, cured film and its manufacture method, liquid crystal indicator, organic electroluminescence display device and method of manufacturing same and touch screen | 富士胶片株式会社 | 2016-12-07 | — | — | CN | disclosed |
| CN-106085316-A | Encapsulating epoxy resin composition and electronic part apparatus | 日立化成工业株式会社 | 2016-11-09 | — | — | CN | disclosed |