SCHEMBL28119925

SCHEMBL28119925

CCNCC(C)(O)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8591432 0.79
SCHEMBL5886710 0.79 POLB (0.32)
SCHEMBL3160885 0.77
SCHEMBL1133057 0.77
SCHEMBL2014024 0.74 TP53 (0.39)
SCHEMBL5623407 0.74
SCHEMBL5731921 0.74
Hydrochloric Acid SCHEMBL5739652 0.74
SCHEMBL19073881 0.74 KDM4E (0.35)
SCHEMBL993289 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106458849-B The manufacture method of copper compound, film formation raw material and film 株式会社ADEKA 2018-02-13 CN disclosed
CN-106458849-A Copper compound, starting material for forming thin film and method for producing thin film 株式会社ADEKA 2017-02-22 CN disclosed