⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL132533 | 0.76 | — | — | |
| SCHEMBL4162739 | 0.76 | — | — | |
| SCHEMBL28259690 | 0.72 | — | — | |
| SCHEMBL28207709 | 0.68 | — | — | |
| SCHEMBL28188460 | 0.67 | — | — | |
| SCHEMBL28791338 | 0.64 | — | — | |
| SCHEMBL6560369 | 0.64 | — | — | |
| SCHEMBL11648348 | 0.63 | — | — | |
| SCHEMBL216019 | 0.63 | — | — | |
| SCHEMBL29246292 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107573696-B | High-temperature-resistant organic silicon gel for high-power IGBT packaging and preparation method and application thereof | 株洲时代电气绝缘有限责任公司 | 2021-01-19 | — | — | CN | claimed |
| CN-107573696-A | A kind of high-power IGBT encapsulation high-temperature resistant silicone gel and its preparation method and application | 株洲时代新材料科技股份有限公司 | 2018-01-12 | — | — | CN | claimed |
| CN-107501557-A | A kind of MDT phenyl polysiloxanes and its preparation method and application | 株洲时代新材料科技股份有限公司 | 2017-12-22 | — | — | CN | claimed |
| CN-107573696-B | High-temperature-resistant organic silicon gel for high-power IGBT packaging and preparation method and application thereof | 株洲时代电气绝缘有限责任公司 | 2021-01-19 | — | — | CN | disclosed |