Benzene

Benzene

SCHEMBL28192913

CNC.CNC.c1ccccc1

nearest known ligand 0.43

Full drug profile on Sugi Atlas →

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.43
TP53 P04637 1/20 0.43
KCNN4 O15554 1/20 0.33
KDM4E B2RXH2 3/20 0.32
MAPT P10636 3/20 0.32
CYP3A4 P08684 2/20 0.32
ALDH1A1 P00352 2/20 0.30
HPGD P15428 2/20 0.30
ATM Q13315 1/20 0.30
TAAR1 Q96RJ0 1/20 0.30
USP2 O75604 1/20 0.30
POLB P06746 1/20 0.30
RECQL P46063 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30
HSD17B10 Q99714 1/20 0.30
TDP1 Q9NUW8 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzene SCHEMBL890697 1.00
Benzene SCHEMBL27922842 1.00 TSHR (0.43) TSHRTP53KCNN4KDM4EMAPT
Benzene SCHEMBL8762728 0.94 KDM4E (0.40) TSHRTP53KCNN4KDM4EMAPT
Benzene SCHEMBL10622514 0.88 TSHR (0.35) TSHRTP53KCNN4
Benzene SCHEMBL1884247 0.84 KDM4E (0.33) TSHRTP53KDM4EMAPTCYP3A4
Dimethylamine SCHEMBL137071 0.77
Dimethylamine SCHEMBL137069 0.77
Dimethylamine SCHEMBL5164633 0.76
Dimethylamine SCHEMBL1030 0.76
Dimethylamine SCHEMBL13695986 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108779066-A Xylylene diisocyanate composition, resin, and polymerizable composition 三井化学株式会社 2018-11-09 CN disclosed
CN-104769010-B The manufacture method of polyamide 三菱瓦斯化学株式会社 2017-12-01 CN disclosed
CN-102648232-B Copolymerized polyamide resin, method for producing same, resin composition, and molded article formed from the copolymerized polyamide resin or the resin composition MITSUBISHI GAS CHEMICAL CO 2015-06-24 CN disclosed