SCHEMBL2828604

SCHEMBL2828604

CC1(COCCOCCOCC2(C)COC2)COC1

nearest known ligand 0.44

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.44
DHFR P00374 1/20 0.30
DCPS Q96C86 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2825441 1.00 EPHX1 (0.44) EPHX1DHFRDCPS
SCHEMBL2829720 1.00 EPHX1 (0.44) EPHX1DHFRDCPS
SCHEMBL2827671 1.00 EPHX1 (0.44) EPHX1DHFRDCPS
SCHEMBL2831544 0.97 EPHX1 (0.46) EPHX1DHFRDCPS
SCHEMBL2623189 0.91 EPHX1 (0.38) EPHX1
SCHEMBL2623186 0.89 EPHX1 (0.39) EPHX1
SCHEMBL8831115 0.88 EPHX1 (0.42) EPHX1
SCHEMBL1978276 0.87 EPHX1 (0.50) EPHX1DHFRDCPS
SCHEMBL29235152 0.87 EPHX1 (0.38) EPHX1
SCHEMBL12677064 0.86 EPHX1 (0.41) EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2177566-B1 METHOD FOR PRODUCTION OF WATER-ABSORBABLE RESIN, AND WATER-ABSORBABLE RESIN PRODUCED BY THE METHOD SUMITOMO SEIKA CHEMICALS (JP) 2017-05-03 EP disclosed
CN-105295082-A Multi-layer base material and image display device DAINIPPON PRINTING CO LTD 2016-02-03 CN disclosed
US-20100197491-A1 METHOD FOR PRODUCTION OF WATER-ABSORBABLE RESIN, AND WATER-ABSORBABLE RESIN PRODUCED BY THE METHOD SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2010-08-05 US disclosed
US-7728050-B2 Curable composition, ink composition, inkjet recording method, printed matter, method for producing planographic printing plate, planographic printing plate and oxetane compound FUJIFILM CORPORATION (JP) 2010-06-01 US disclosed
US-7728050-B2 Curable composition, ink composition, inkjet recording method, printed matter, method for producing planographic printing plate, planographic printing plate and oxetane compound FUJIFILM CORPORATION (JP) 2010-06-01 US disclosed
EP-2177566-A1 METHOD FOR PRODUCTION OF WATER-ABSORBABLE RESIN, AND WATER-ABSORBABLE RESIN PRODUCED BY THE METHOD SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2010-04-21 EP disclosed
US-20070112088-A1 Curable composition, ink composition, inkjet recording method, printer matter, method for producing planographic printing plate, planographic printing plate and oxetane compound FUJIFILM CORPORATION 2007-05-17 US disclosed
US-20070112088-A1 Curable composition, ink composition, inkjet recording method, printer matter, method for producing planographic printing plate, planographic printing plate and oxetane compound FUJIFILM CORPORATION 2007-05-17 US disclosed
EP-1783184-A1 Curable ink composition and oxetane compound Fujifilm Corporation (JP) 2007-05-09 EP disclosed