Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.67 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.67 |
| ▸ | CA5A | P35218 | 1/20 | 0.46 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 3/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL1962146 | 1.00 | MEN1 (0.67) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL193771 | 1.00 | MEN1 (0.67) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL10423957 | 1.00 | MEN1 (0.67) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL11889480 | 0.94 | MEN1 (0.78) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL16535772 | 0.94 | MEN1 (0.60) | MEN1KMT2ACA5ACA5BTSHR | |
| SCHEMBL35164 | 0.94 | — | — | |
| SCHEMBL9785909 | 0.94 | MEN1 (0.75) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL2479392 | 0.88 | MEN1 (0.88) | MEN1KMT2ACA5ACA5BTSHR | |
| Ammonia Solution, Strong SCHEMBL1506954 | 0.88 | — | — | |
| Ammonia Solution, Strong SCHEMBL4896558 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2008023339-A2 | METHOD AND COMPOSITION FOR THE DEPOSITION OF PALLADIUM LAYERS AND PALLADIUM ALLOY LAYERS | ENTHONE INC. (US) | 2008-02-28 | — | — | WO | claimed |
| WO-2010075056-A2 | AIRCRAFT AIR TREATMENT CATALYSTS, SYSTEMS AND METHODS | BASF CATALYSTS LLC (US) | 2010-07-01 | — | — | WO | disclosed |
| US-20100152032-A1 | Aircraft Air Treatment Catalysts, Systems and Methods | BASF CATALYSTS LLC (US) | 2010-06-17 | — | — | US | disclosed |
| US-7732002-B2 | Method for the fabrication of conductive electronic features | CABOT CORPORATION (US) | 2010-06-08 | — | — | US | disclosed |
| US-20100112195-A1 | METHOD FOR THE FABRICATION OF CONDUCTIVE ELECTRONIC FEATURES | CABOT CORPORATION | 2010-05-06 | — | — | US | disclosed |
| US-7691772-B2 | Dispersion of metal compound , organic material and metal oxide carrier in solvent; bonding, calcining | TANAKA KIKINZOKU KOGYO K.K. (JP) | 2010-04-06 | — | — | US | disclosed |
| US-7553512-B2 | Method for fabricating an inorganic resistor | CABOT CORPORATION (US) | 2009-06-30 | — | — | US | disclosed |
| US-20080242533-A1 | Catalyst and Method for Producing Catalyst | TANAKA KIKINZOKU KOGYO K.K. (JP) | 2008-10-02 | — | — | US | disclosed |
| WO-2008023339-A2 | METHOD AND COMPOSITION FOR THE DEPOSITION OF PALLADIUM LAYERS AND PALLADIUM ALLOY LAYERS | ENTHONE INC. (US) | 2008-02-28 | — | — | WO | disclosed |
| EP-1892320-A1 | Electrolyte composition and method for the electrolytic deposition of layers containing palladium | ENTHONE, INCORPORATED (US) | 2008-02-27 | — | — | EP | disclosed |
| EP-1444055-A4 | TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES | SUPERIOR MICROPOWDERS LLC (US) | 2007-04-18 | — | — | EP | disclosed |
| EP-1712277-A1 | CATALYST AND METHOD FOR PRODUCING CATALYST | TANAKA KIKINZOKU KOGYO KABUSHIKI KAISHA (JP) | 2006-10-18 | — | — | EP | disclosed |
| US-6811674-B2 | A PALLADIUM PLATING SOLUTION CONSISTS OF A SOLUBLE PALLADIUM SALT, A SULFAMIC ACID OR ITS SALT, FREE FROM BRIGHTENING AGENT; PALLADIUM PLATING SOLUTION WHICH CAN FORM A PLATED SURFACE HAVING GOOD ADHESION TO RESIN | MATSUDA SANGYO CO., LTD. (JP) | 2004-11-02 | — | — | US | disclosed |
| EP-1444055-A1 | TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES | Superior Micropowders LLC (US) | 2004-08-11 | — | — | EP | disclosed |
| US-20030161959-A1 | Precursor compositions for the deposition of passive electronic features | CABOT CORPORATION | 2003-08-28 | — | — | US | disclosed |
| WO-2003035279-A1 | TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES | SUPERIOR MICROPOWDERS LLC (US) | 2003-05-01 | — | — | WO | disclosed |
| US-20020144909-A1 | A palladium plating solution consists of a soluble palladium salt, a sulfamic acid or its salt, free from brightening agent; palladium plating solution which can form a plated surface having good adhesion to resin | MATSUDA SANGYO CO., LTD. | 2002-10-10 | — | — | US | disclosed |
| US-5409877-A | Two or more catalytic metal components on silica gel support | DIRECTOR-GENERAL OF AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 1995-04-25 | — | — | US | disclosed |
| US-4778578-A | POROUS ELECTROCONDUCTIVE FILM BONDED TO SURFACE; ELECTROLYTIC GENERATION OF CHLORINE | ORONZIO DE NORA IMPIANTI ELETTROCHIMICI S.P.A. (IT) | 1988-10-18 | — | — | US | disclosed |
| US-4364803-A | ADSORPTION OF AMPHOTERIC COMPOUND BEFORE ELECTROLESS DEPOSITION OF GROUP 8 METAL | ORONZIO DE NORA IMPIANTI ELETTROCHIMICI S.P.A. (IT) | 1982-12-21 | — | — | US | disclosed |