Sulfuric Acid

Sulfuric Acid

SCHEMBL2831489

N.N.N.N.O=S(=O)([O-])[O-].O=S(=O)([O-])[O-].[Pd+4]

nearest known ligand 0.42

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.42
ALDH1A1 P00352 1/20 0.42
TSHR P16473 1/20 0.42
KMT2A Q03164 1/20 0.42
TP53 P04637 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfuric Acid SCHEMBL2834855 1.00 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL5603827 0.94 MEN1 (0.46) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL9092346 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL9683400 0.88
Sulfuric Acid SCHEMBL9453215 0.88
Sulfuric Acid SCHEMBL8505519 0.88
Sulfuric Acid SCHEMBL7705015 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL3116870 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL6416408 0.88 MEN1 (0.42) MEN1ALDH1A1TSHRKMT2ATP53
Sulfuric Acid SCHEMBL619135 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008023339-A2 METHOD AND COMPOSITION FOR THE DEPOSITION OF PALLADIUM LAYERS AND PALLADIUM ALLOY LAYERS ENTHONE INC. (US) 2008-02-28 WO claimed
US-6811674-B2 A PALLADIUM PLATING SOLUTION CONSISTS OF A SOLUBLE PALLADIUM SALT, A SULFAMIC ACID OR ITS SALT, FREE FROM BRIGHTENING AGENT; PALLADIUM PLATING SOLUTION WHICH CAN FORM A PLATED SURFACE HAVING GOOD ADHESION TO RESIN MATSUDA SANGYO CO., LTD. (JP) 2004-11-02 US claimed
WO-2010075056-A2 AIRCRAFT AIR TREATMENT CATALYSTS, SYSTEMS AND METHODS BASF CATALYSTS LLC (US) 2010-07-01 WO disclosed
US-20100152032-A1 Aircraft Air Treatment Catalysts, Systems and Methods BASF CATALYSTS LLC (US) 2010-06-17 US disclosed
WO-2008023339-A2 METHOD AND COMPOSITION FOR THE DEPOSITION OF PALLADIUM LAYERS AND PALLADIUM ALLOY LAYERS ENTHONE INC. (US) 2008-02-28 WO disclosed
EP-1892320-A1 Electrolyte composition and method for the electrolytic deposition of layers containing palladium ENTHONE, INCORPORATED (US) 2008-02-27 EP disclosed
US-6811674-B2 A PALLADIUM PLATING SOLUTION CONSISTS OF A SOLUBLE PALLADIUM SALT, A SULFAMIC ACID OR ITS SALT, FREE FROM BRIGHTENING AGENT; PALLADIUM PLATING SOLUTION WHICH CAN FORM A PLATED SURFACE HAVING GOOD ADHESION TO RESIN MATSUDA SANGYO CO., LTD. (JP) 2004-11-02 US disclosed
US-20020144909-A1 A palladium plating solution consists of a soluble palladium salt, a sulfamic acid or its salt, free from brightening agent; palladium plating solution which can form a plated surface having good adhesion to resin MATSUDA SANGYO CO., LTD. 2002-10-10 US disclosed