⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20063846 | 0.73 | — | — | |
| SCHEMBL13817722 | 0.60 | — | — | |
| SCHEMBL20063831 | 0.60 | — | — | |
| SCHEMBL12921431 | 0.59 | — | — | |
| SCHEMBL12035111 | 0.59 | — | — | |
| SCHEMBL8177707 | 0.59 | — | — | |
| SCHEMBL373319 | 0.59 | — | — | |
| SCHEMBL373318 | 0.59 | — | — | |
| Hydrochloric Acid SCHEMBL22691506 | 0.58 | — | — | |
| SCHEMBL2047944 | 0.57 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7666573-B2 | Positive photosensitive resin composition and method for forming pattern | MITSUI CHEMICALS, INC. (JP) | 2010-02-23 | — | — | US | disclosed |
| US-20090208868-A1 | Polyimides; polynorbornenes; photomasks; heat treatment; heat resistance; flame resistance | MITSUI CHEMICALS , INC. (JP) | 2009-08-20 | — | — | US | disclosed |
| EP-1321487-B1 | POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE | MITSUI CHEMICALS INC (JP) | 2008-02-27 | — | — | EP | disclosed |
| US-6710160-B2 | VARNISH HAVING IMPROVED SMOOTHNESS, THERMAL RESISTANCE, MELT FLOWABILITY, OPTICAL PROPERTIES AND CHEMICAL RESISTANCE; DIELECTRICS | MITSUI CHEMICALS, INC. (JP) | 2004-03-23 | — | — | US | disclosed |
| EP-1321487-A1 | POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE | Mitsui Chemicals, Inc. (JP) | 2003-06-25 | — | — | EP | disclosed |
| US-20020188090-A1 | Polyamic acid, polyimide, process for producing these, and film of the polyimide | MITSUI CHEMICALS, INC. (JP) | 2002-12-12 | — | — | US | disclosed |