SCHEMBL2833675

SCHEMBL2833675

CCCCCCCCCCCCCCCCC(Cl)(Cl)Cl

nearest known ligand 0.50

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.50
THRB P10828 1/20 0.50
ALDH1A1 P00352 1/20 0.45
FDPS P14324 10/20 0.44
SMPD1 P17405 2/20 0.44
GGPS1 O95749 6/20 0.42
CES2 O00748 1/20 0.39
LPAR1 Q92633 1/20 0.39
LPAR3 Q9UBY5 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11370224 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL55151 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL16180459 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL16970225 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL349512 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL16970217 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL16969980 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL16969619 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL665460 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1
SCHEMBL16969776 1.00 TSHR (0.50) TSHRTHRBALDH1A1FDPSSMPD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed
US-8506905-B2 Method of forming bilayer membrane by contact between amphipathic monolayers and apparatus therefor THE UNIVERSITY OF TOKYO (JP) 2013-08-13 US disclosed
US-20100147450-A1 METHOD OF FORMING BILAYER MEMBRANE BY CONTACT BETWEEN AMPHIPATHIC MONOLAYERS AND APPARATUS THEREFOR THE UNIVERSITY OF TOKYO (JP) 2010-06-17 US disclosed
US-5869136-A Method of manufacturing a chemically adsorbed multilayer film MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1999-02-09 US disclosed
EP-0558083-B1 Method of manufacturing a chemically adsorbed multilayer film MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 1997-11-19 EP disclosed
EP-0558083-A1 Method of manufacturing a chemically adsorbed multilayer film MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1993-09-01 EP disclosed
EP-0153133-B1 ASSEMBLING MULTILAYERS OF POLYMERIZABLE SURFACTANT ON A SURFACE OF A SOLID MATERIAL MARQUETTE UNIVERSITY (US) 1991-12-04 EP disclosed
US-4560599-A AMPHOTERIC PHOSPOLIPIDS; POLYETHYLENE SUBSTRATE MARQUETTE UNIVERSITY (US) 1985-12-24 US disclosed
EP-0153133-A2 Assembling multilayers of polymerizable surfactant on a surface of a solid material MARQUETTE UNIVERSITY (US) 1985-08-28 EP disclosed