⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29139315 | 0.82 | — | — | |
| SCHEMBL29281863 | 0.77 | — | — | |
| SCHEMBL28167122 | 0.75 | — | — | |
| SCHEMBL4023148 | 0.73 | — | — | |
| SCHEMBL18519211 | 0.72 | — | — | |
| SCHEMBL120662 | 0.71 | — | — | |
| SCHEMBL1317314 | 0.70 | — | — | |
| SCHEMBL29024602 | 0.70 | — | — | |
| SCHEMBL428475 | 0.70 | — | — | |
| SCHEMBL2471664 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118302490-A | Resin composition, molded body, and optical member | 日本瑞翁株式会社 | 2024-07-05 | — | — | CN | disclosed |
| CN-116916871-A | container | 日本瑞翁株式会社 | 2023-10-20 | — | — | CN | disclosed |
| CN-115769401-A | Binder composition for nonaqueous secondary battery electrode, method for producing same, slurry composition for nonaqueous secondary battery electrode, electrode for nonaqueous secondary battery, and nonaqueous secondary battery | 日本瑞翁株式会社 | 2023-03-07 | — | — | CN | disclosed |
| WO-2022045315-A1 | BINDER COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY ELECTRODES, METHOD FOR PRODUCING SAME, SLURRY COMPOSITION FOR NONAQUEOUS SECONDARY BATTERY ELECTRODES, ELECTRODE FOR NONAQUEOUS SECONDARY BATTERIES, AND NONAQUEOUS SECONDARY BATTERY | 日本ゼオン株式会社 | 2022-03-03 | — | — | WO | disclosed |
| CN-107406559-B | Copolymer, polymer, molding material, and resin molded article | 日本瑞翁株式会社 | 2022-01-11 | — | — | CN | disclosed |
| CN-107636070-B | Resin composition, resin laminate, and resin-laminated metal foil | 日本瑞翁株式会社 | 2021-03-26 | — | — | CN | disclosed |
| CN-108136732-B | Laminate, method for producing same, and flexible printed circuit board | 日本瑞翁株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-107849337-B | Resin composition and resin molded article | 日本瑞翁株式会社 | 2021-02-23 | — | — | CN | disclosed |
| CN-107250262-B | Resin composition and resin molded article | 日本瑞翁株式会社 | 2019-12-20 | — | — | CN | disclosed |