SCHEMBL28374804

SCHEMBL28374804

CCCCOC1=Cc2c(ccc3ccccc23)C(=O)C1=O

nearest known ligand 0.46

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ TDP1 Q9NUW8 2/20 0.46
▸ L3MBTL1 Q9Y468 2/20 0.46
▸ GAA P10253 1/20 0.46
▸ SLC2A1 P11166 1/20 0.41
▸ TP53 P04637 1/20 0.41
▸ CNR1 P21554 2/20 0.40
▸ CNR2 P34972 2/20 0.40
▸ KCNH2 Q12809 3/20 0.39
▸ DNMT1 P26358 1/20 0.39
▸ PTPN1 P18031 2/20 0.38
▸ HTR1B P28222 2/20 0.37
▸ ALDH1A1 P00352 1/20 0.37
▸ LMNA P02545 1/20 0.37
▸ NPY1R P25929 1/20 0.37
▸ NPY2R P49146 1/20 0.37
▸ METAP2 P50579 1/20 0.37
▸ BTK Q06187 1/20 0.37
▸ CYP2C9 P11712 1/20 0.36
▸ HTR1D P28221 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28372133 0.80 MAPT (0.47) TDP1TP53DNMT1PTPN1ALDH1A1
SCHEMBL9628020 0.69 CDC25B (0.59) PTPN1ALDH1A1
SCHEMBL10959580 0.68 DNMT1 (0.49) TDP1TP53DNMT1PTPN1ALDH1A1
SCHEMBL8650629 0.68 DNMT1 (0.49) TDP1TP53DNMT1PTPN1ALDH1A1
SCHEMBL29708071 0.68 DNMT1 (0.49) TDP1GAATP53DNMT1PTPN1
SCHEMBL11790344 0.68 DNMT1 (0.49) TDP1SLC2A1TP53KCNH2DNMT1
SCHEMBL8210093 0.68 DNMT1 (0.49) TDP1TP53DNMT1PTPN1ALDH1A1
SCHEMBL28755138 0.68 DNMT1 (0.49) TDP1GAATP53DNMT1PTPN1
SCHEMBL28372991 0.68 CDC25A (0.51) TDP1TP53DNMT1PTPN1ALDH1A1
SCHEMBL22634161 0.67 DNMT1 (0.60) TDP1L3MBTL1TP53DNMT1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110520433-B Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition, and cured product thereof 日铁化学材料株式会社 2023-12-05 — — CN disclosed
CN-110951048-B Phosphorus-containing hardener, epoxy resin composition, cured product, prepreg, and laminate 日铁化学材料株式会社 2023-09-29 — — CN disclosed
CN-110194843-B Phosphorus-containing phenoxy resin, resin composition, material for circuit board, and cured product 日铁化学材料株式会社 2023-01-03 — — CN disclosed
CN-110951048-A Phosphorus-containing curing agent, epoxy resin composition, cured product, prepreg, and laminate 日铁化学材料株式会社 2020-04-03 — — CN disclosed
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