⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL287637 | 0.62 | — | — | |
| SCHEMBL17042499 | 0.60 | — | — | |
| SCHEMBL1742689 | 0.57 | — | — | |
| SCHEMBL9315427 | 0.55 | — | — | |
| SCHEMBL8816870 | 0.55 | — | — | |
| SCHEMBL9067680 | 0.53 | — | — | |
| SCHEMBL18894299 | 0.52 | — | — | |
| SCHEMBL11138213 | 0.51 | — | — | |
| SCHEMBL9623477 | 0.51 | — | — | |
| SCHEMBL11799495 | 0.51 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118368804-A | FRP precursor, laminate, metal-clad laminate, printed wiring board, semiconductor package, and method for producing same | 株式会社力森诺科 | 2024-07-19 | — | — | CN | disclosed |
| CN-118082347-A | Prepreg, printed wiring board, semiconductor package, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2024-05-28 | — | — | CN | disclosed |
| CN-114126226-A | Method for manufacturing printed wiring board | 味之素株式会社 | 2022-03-01 | — | — | CN | disclosed |
| CN-112210045-A | Resin composition | 味之素株式会社 | 2021-01-12 | — | — | CN | disclosed |
| CN-112109402-A | Resin sheet | 味之素株式会社 | 2020-12-22 | — | — | CN | disclosed |
| CN-111187486-A | Resin composition, resin sheet, printed wiring board, and semiconductor device | 味之素株式会社 | 2020-05-22 | — | — | CN | disclosed |