SCHEMBL28423760

SCHEMBL28423760

C=CN1C=CN(CC(N)O)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11938828 0.80 MAPT (0.34)
Hydrochloric Acid SCHEMBL7755447 0.80
Hydrochloric Acid SCHEMBL29233012 0.79 MAPT (0.33)
Bromide SCHEMBL29233016 0.79
SCHEMBL28255573 0.76
SCHEMBL29054542 0.74
SCHEMBL28588438 0.72
Bromide SCHEMBL29054532 0.72
Bromide SCHEMBL28977692 0.72
SCHEMBL1403583 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111518368-B Fast-curing high-heat-resistance high-toughness resin matrix and preparation method thereof 北京化工大学 2021-06-08 CN disclosed
CN-111518368-A Fast-curing high-heat-resistance high-toughness resin matrix and preparation method thereof 北京化工大学 2020-08-11 CN disclosed
CN-109053576-B Ionic liquid curing agent suitable for epoxy resin and preparation method thereof 中国科学院过程工程研究所 2020-06-19 CN disclosed