SCHEMBL284259

SCHEMBL284259

CO[Si](OC)(OC)C12CCCCC1O2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7765316 0.79
SCHEMBL1485732 0.78
SCHEMBL7192066 0.75
SCHEMBL1129681 0.69
SCHEMBL4147616 0.65
SCHEMBL5675346 0.64
SCHEMBL1023347 0.62
SCHEMBL27294763 0.62
SCHEMBL7522149 0.61
SCHEMBL9133434 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119752355-A Low-water-vapor-permeability organic silicon sealant and preparation method thereof 广州白云科技股份有限公司 2025-04-04 CN claimed
CN-119177109-A Dealcoholized silicone sealant capable of being rapidly cured in initial stage and preparation method thereof 广州白云科技股份有限公司 2024-12-24 CN claimed
CN-118813198-A Silicone adhesive suitable for packaging electronic components and preparation method thereof 宁波有航新材料有限公司 2024-10-22 CN claimed
CN-118315766-A High-performance lithium ion battery diaphragm based on covalent coupling and preparation method thereof 湖南科技大学 2024-07-09 CN claimed
US-20240132749-A1 URETHANE ALKYD RESIN Asian Paints Ltd. (IN) 2024-04-25 US claimed
CN-112724925-B Two-component organic silicon packaging adhesive and preparation method and application thereof 广州市白云化工实业有限公司 2022-08-02 CN claimed
CN-113292844-A Low-temperature-resistant polyamide resin composite material with good flexibility and preparation method thereof 中平神马江苏新材料科技有限公司 2021-08-24 CN claimed
CN-109627770-B Dealcoholized condensed type double-component room temperature vulcanized silicone rubber and preparation method thereof 广州市白云化工实业有限公司 2021-07-27 CN claimed
CN-112724925-A Two-component organic silicon packaging adhesive and preparation method and application thereof 广州市白云化工实业有限公司 2021-04-30 CN claimed
CN-112680174-A Modified silicone adhesive, preparation method and application thereof, and vacuum glass 郑州圣莱特空心微珠新材料有限公司 2021-04-20 CN claimed
CN-106350001-B organosilicon sealant ceramized at high temperature and preparation method thereof 广州集泰化工股份有限公司 2019-12-17 CN claimed
US-20190330418-A1 An Improved Urethane Alkyd Resin Asian Paints Ltd. (IN) 2019-10-31 US claimed
WO-2019102491-A1 AN IMPROVED URETHANE ALKYD RESIN ASIAN PAINTS LTD (IN) 2019-05-31 WO claimed
CN-109694686-A Single-component silicone fluid sealant and preparation method thereof 广州市白云化工实业有限公司 2019-04-30 CN claimed
CN-106833507-A Multicomponent silicone sealant and preparation method thereof 广州市白云化工实业有限公司 2017-06-13 CN claimed
CN-106634806-A Single-ingredient silicone structural sealant and preparation method thereof 广州市白云化工实业有限公司 2017-05-10 CN claimed
CN-104531049-B Anti-pollution silicone weather-resistant sealant and preparation method of sealant 广州市白云化工实业有限公司 2017-04-19 CN claimed
CN-104673180-B Condensed type double-component silicone sealant and preparation method thereof 广州市白云化工实业有限公司 2016-11-16 CN claimed
US-7868546-B2 Organic light emitting display device and method of manufacturing the same SAMSUNG MOBILE DISPLAY CO., LTD. (KR) 2011-01-11 US claimed
CN-119752355-A Low-water-vapor-permeability organic silicon sealant and preparation method thereof 广州白云科技股份有限公司 2025-04-04 CN disclosed
CN-119177109-A Dealcoholized silicone sealant capable of being rapidly cured in initial stage and preparation method thereof 广州白云科技股份有限公司 2024-12-24 CN disclosed
WO-2024224984-A1 COMPOSITE RESIN AND METHOD FOR PRODUCING SAME DIC株式会社 2024-10-31 WO disclosed
WO-2024224983-A1 COMPOSITION, NEGATIVE ELECTRODE ACTIVE MATERIAL, METHOD FOR MANUFACTURING NEGATIVE ELECTRODE ACTIVE MATERIAL, AND SECONDARY BATTERY DIC株式会社 2024-10-31 WO disclosed
CN-118813198-A Silicone adhesive suitable for packaging electronic components and preparation method thereof 宁波有航新材料有限公司 2024-10-22 CN disclosed
CN-118315766-A High-performance lithium ion battery diaphragm based on covalent coupling and preparation method thereof 湖南科技大学 2024-07-09 CN disclosed
US-20240132749-A1 URETHANE ALKYD RESIN Asian Paints Ltd. (IN) 2024-04-25 US disclosed
EP-3212725-B1 OLED-COMPATIBLE ADHESIVE MASSES HAVING SILANE WATER SCAVENGERS TESA SE (DE) 2024-03-06 EP disclosed
CN-114096626-B Method for forming a biodegradable or recyclable hybrid material composition 布莱特普卢斯公司 2023-11-03 CN disclosed
CN-110997816-B Dual curable silicone composition 美国陶氏有机硅公司 2022-08-23 CN disclosed
CN-112724925-B Two-component organic silicon packaging adhesive and preparation method and application thereof 广州市白云化工实业有限公司 2022-08-02 CN disclosed
CN-111892906-B Dealcoholized single-component silicone sealant capable of being rapidly and deeply cured and preparation method thereof 广州市白云化工实业有限公司 2022-07-01 CN disclosed
EP-3662020-B1 DUAL CURABLE SILICONE COMPOSITIONS DOW SILICONES CORP (US) 2022-01-26 EP disclosed
CN-113292844-A Low-temperature-resistant polyamide resin composite material with good flexibility and preparation method thereof 中平神马江苏新材料科技有限公司 2021-08-24 CN disclosed
US-11028286-B2 Dual curable silicone compositions DOW SILICONES CORPORATION (US) 2021-06-08 US disclosed
CN-112724925-A Two-component organic silicon packaging adhesive and preparation method and application thereof 广州市白云化工实业有限公司 2021-04-30 CN disclosed
CN-112680174-A Modified silicone adhesive, preparation method and application thereof, and vacuum glass 郑州圣莱特空心微珠新材料有限公司 2021-04-20 CN disclosed
CN-109096945-B Tackifier applied to silicone sealant and preparation method thereof 广州雷斯曼新材料科技有限公司 2021-03-02 CN disclosed
CN-111892906-A Dealcoholized single-component silicone sealant capable of being rapidly and deeply cured and preparation method thereof 广州市白云化工实业有限公司 2020-11-06 CN disclosed
EP-3000784-B1 SILICA SOL AND SILICA-CONTAINING EPOXY RESIN COMPOSITION NISSAN CHEMICAL CORP (JP) 2020-07-15 EP disclosed
US-20200199403-A1 DUAL CURABLE SILICONE COMPOSITIONS DOW SILICONES CORPORATION 2020-06-25 US disclosed
EP-3662020-A1 DUAL CURABLE SILICONE COMPOSITIONS Dow Silicones Corporation (US) 2020-06-10 EP disclosed
CN-106634806-B Single-component silicone structural sealant and preparation method thereof 广州市白云化工实业有限公司 2020-05-08 CN disclosed
CN-111057518-A Two-component silicone sealant for door and window seams and preparation method thereof 广州市白云化工实业有限公司 2020-04-24 CN disclosed
US-10626305-B2 OLED-compatible adhesive masses having silane water scavengers TESA SE (DE) 2020-04-21 US disclosed
CN-110997816-A Dual curable silicone composition 美国陶氏有机硅公司 2020-04-10 CN disclosed
CN-106350001-B organosilicon sealant ceramized at high temperature and preparation method thereof 广州集泰化工股份有限公司 2019-12-17 CN disclosed
CN-106590519-B Condensed type bi-component silicone sealant and preparation method GUANGZHOU BAIYUN CHEMICAL INDUSTRY Co.,Ltd. (CN) 2019-11-01 CN disclosed
US-20190330418-A1 An Improved Urethane Alkyd Resin Asian Paints Ltd. (IN) 2019-10-31 US disclosed
CN-106085346-B Anti-pollution silicone sealant with self-cleaning function and preparation method thereof 广州市白云化工实业有限公司 2019-06-04 CN disclosed
WO-2019102491-A1 AN IMPROVED URETHANE ALKYD RESIN ASIAN PAINTS LTD (IN) 2019-05-31 WO disclosed
CN-109694686-A Single-component silicone fluid sealant and preparation method thereof 广州市白云化工实业有限公司 2019-04-30 CN disclosed
WO-2019027717-A1 DUAL CURABLE SILICONE COMPOSITIONS DOW SILICONES CORPORATION (US) 2019-02-07 WO disclosed
CN-109096945-A A kind of tackifier and preparation method thereof applied to silicone sealant 广州雷斯曼新材料科技有限公司 2018-12-28 CN disclosed
WO-2018132685-A1 QUANTITATIVE MEASUREMENT OF MEMBRANE PROTEIN FUNCTION ON A BIOSENSOR NANOTECH BIOMACHINES, INC. (US) 2018-07-19 WO disclosed
US-9969867-B2 Silica sol and silica-containing epoxy resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-05-15 US disclosed
US-20170247582-A1 OLED-COMPATIBLE ADHESIVE MASSES HAVING SILANE WATER SCAVENGERS TESA SE (DE) 2017-08-31 US disclosed
CN-107001879-A OLED compatibility adhesive comprising silane water scavenger 德莎欧洲公司 2017-08-01 CN disclosed
CN-105263860-B Ludox and silica containing composition epoxy resin 日产化学工业株式会社 2017-06-27 CN disclosed
CN-106833507-A Multicomponent silicone sealant and preparation method thereof 广州市白云化工实业有限公司 2017-06-13 CN disclosed
CN-106634806-A Single-ingredient silicone structural sealant and preparation method thereof 广州市白云化工实业有限公司 2017-05-10 CN disclosed
CN-106590519-A Condensed dual-component silicone sealant and preparation method thereof 广州市白云化工实业有限公司 2017-04-26 CN disclosed
CN-104531049-B Anti-pollution silicone weather-resistant sealant and preparation method of sealant 广州市白云化工实业有限公司 2017-04-19 CN disclosed
CN-106350001-A Organic silicon sealant capable of being ceramized at high temperature and preparation method of organic silicon sealant 广州集泰化工股份有限公司 2017-01-25 CN disclosed
US-20160376440-A1 ASPHALT ADDITIVE, ASPHALT COMPOSITIONS AND PRODUCTS COMPRISING SUCH ADDITIVE, ASPHALT SURFACES COMPRISING SUCH ADDITIVE, METHODS OF MAKING AND USING SUCH ADDITIVE, COMPOSITIONS, SURFACES AND PRODUCTS GREEN PAVING SOLUTIONS, LLC (US) 2016-12-29 US disclosed
CN-104673180-B Condensed type double-component silicone sealant and preparation method thereof 广州市白云化工实业有限公司 2016-11-16 CN disclosed
CN-106085346-A Anti-pollution silicone sealant with self-cleaning function and preparation method thereof 广州市白云化工实业有限公司 2016-11-09 CN disclosed
EP-1804310-B1 Organic light emiting device and method of manufacturing the same SAMSUNG DISPLAY CO LTD (KR) 2016-10-19 EP disclosed
EP-3000784-A1 SILICA SOL AND SILICA-CONTAINING EPOXY RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2016-03-30 EP disclosed
US-20160068664-A1 SILICA SOL AND SILICA-CONTAINING EPOXY RESIN COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2016-03-10 US disclosed
US-8801997-B2 Fabrication method of flexible devices KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2014-08-12 US disclosed
CN-103956375-A Organic light emitting device and method of manufacturing the same SAMSUNG DISPLAY CO LTD 2014-07-30 CN disclosed
US-8399270-B2 Method of manufacturing organic light emitting device with water vapor absorption material containing transparent sealant layer SAMSUNG DISPLAY CO., LTD. (KR) 2013-03-19 US disclosed
US-20120061881-A1 Fabrication Method of Flexible Devices KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2012-03-15 US disclosed
EP-2428988-A1 Method of fabricating flexible device Korea Advanced Institute of Science and Technology (KR) 2012-03-14 EP disclosed
US-8044584-B2 Organic electroluminescent device and method for manufacturing the same SAMSUNG MOBILE DISPLAY CO., LTD. (KR) 2011-10-25 US disclosed
EP-1307338-B1 MONOLITHIC EXPANDABLE STRUCTURES, METHODS OF MANUFACTURE AND COMPOSITE STRUCTURES HENKEL LOCTITE CORP (US) 2011-10-12 EP disclosed
US-20110244607-A1 ORGANIC LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME SAMSUNG MOBILE DISPLAY CO., LTD. (KR) 2011-10-06 US disclosed
US-8003999-B2 Organic light emitting device SAMSUNG MOBILE DISPLAY CO., LTD. (KR) 2011-08-23 US disclosed
CN-1832643-B Organic electroluminescence display and manufacturing method thereof SAMSUNG SDI CO LTD 2011-06-22 CN disclosed
CN-1842233-B Organic light emitting display device and method of manufacturing the same SAMSUNG SDI CO LTD 2011-06-22 CN disclosed
US-7893614-B2 Organic light emitting display device and method of fabricating the same SAMSUNG MOBILE DISPLAY CO., LTD. (KR) 2011-02-22 US disclosed
US-7868546-B2 Organic light emitting display device and method of manufacturing the same SAMSUNG MOBILE DISPLAY CO., LTD. (KR) 2011-01-11 US disclosed
US-7569624-B2 Thermosetting resins heated with electricity, magnetism, pyrolysis of fillers with adhesives for hardening DEGUSSA AG (DE) 2009-08-04 US disclosed
US-7452585-B1 Monolithic structures, methods of manufacture and composite structures HENKEL CORPORATION (US) 2008-11-18 US disclosed
US-20080199126-A1 Method for Printing a Near Field Photoinduced Stable Structure, and Optical Fiber Tip for Implementing Same ESSILOR INTERNATIONAL COMPAGNIE GENERAL D'OPTIQUE (FR) 2008-08-21 US disclosed
US-20080150419-A1 ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME SAMSUNG SDI CO., LTD. (KR) 2008-06-26 US disclosed
US-7352384-B2 Method for printing a near field photoinduced stable structure, and optical fibre tip for implementing same ESSILOR INTERNATIONAL COMPAGNIE GENERALE D'OPTIQUE (FR) 2008-04-01 US disclosed
US-20070152212-A1 Organic light emitting device and method of manufacturing the same SAMSUNG DISPLAY CO., LTD. (KR) 2007-07-05 US disclosed
EP-1804310-A2 Organic light emiting device and method of manufacturing the same Samsung SDI Co., Ltd. (KR) 2007-07-04 EP disclosed
CN-1992371-A Organic light emitting device and method for manufacturing the same SAMSUNG SDI CO LTD (KR) 2007-07-04 CN disclosed
EP-1444306-B1 CURABLE BONDED ASSEMBLIES CAPABLE OF BEING DISSOCIATED DEGUSSA (DE) 2007-04-04 EP disclosed
US-20060220549-A1 Organic light emitting display device and method of manufacturing the same SAMSUNG DISPLAY CO., LTD. (KR) 2006-10-05 US disclosed
CN-1842233-A Organic light emitting display device and method of manufacturing the same SAMSUNG SDI CO LTD (KR) 2006-10-04 CN disclosed
CN-1832643-A Organic electroluminescence display and manufacturing method thereof SAMSUNG SDI CO LTD (KR) 2006-09-13 CN disclosed
US-20060132034-A1 Organic light emitting device and method of manufacturing the same SAMSUNG MOBILE DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed
US-20060097633-A1 Organic electroluminescent device and method for manufacturing the same SAMSUNG SDI CO., LTD. 2006-05-11 US disclosed
EP-1655792-A1 Organic electroluminescent device and method for manufacturing the same Samsung SDI Co., Ltd. (KR) 2006-05-10 EP disclosed
US-20040249037-A1 Curable bonded assemblies capable of being dissociated EVONIK DEGUSSA GMBH (DE) 2004-12-09 US disclosed
US-20040214115-A1 Method for printing a near field photoinduced stable structure, and optical fiber tip for implementing same ESSILOR INTERNATIONAL (FR) 2004-10-28 US disclosed
EP-1444306-A1 CURABLE BONDED ASSEMBLIES CAPABLE OF BEING DISSOCIATED Degussa AG (DE) 2004-08-11 EP disclosed
US-6630221-B1 Monolithic expandable structures, methods of manufacture and composite structures DEXTER CORPORATION 2003-10-07 US disclosed
WO-2003042315-A1 CURABLE BONDED ASSEMBLIES CAPABLE OF BEING DISSOCIATED DEGUSSA AG (DE) 2003-05-22 WO disclosed
US-5721296-A COMPOSITION COMPRISING WATER SOLUBLE PREPOLYMER WHICH FORMS RESIN IN AQUEOUS SOLUTION, EMULSIFIED ASPHALT, ESTER AND/OR EPOXY COMPOUND POLYMERIZATION ACCELERATOR KAO CORPORATION (JP) 1998-02-24 US disclosed
US-4375988-A Bituminous binder, process for its production and use DEGUSSA AKTIENGESELLSCHAFT (DE) 1983-03-08 US disclosed
US-4375988-A Bituminous binder, process for its production and use DEGUSSA AKTIENGESELLSCHAFT (DE) 1983-03-08 US disclosed