Benzophenone

Benzophenone

SCHEMBL2843203

O=C([C]1C=C[CH]C=C1)[C]1C=C[CH]C=C1

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzoic Acid SCHEMBL1759391 0.78
Phenol SCHEMBL9100774 0.60
SCHEMBL1221734 0.60
Phenylacetic Acid SCHEMBL6047713 0.59 AKR1B1 (0.39)
SCHEMBL5187887 0.53
Toluene SCHEMBL451397 0.52
Terephthalic Acid SCHEMBL9621388 0.52 TSHR (0.41)
Fluorobenzene SCHEMBL1977585 0.52
Chlorobenzene SCHEMBL1976868 0.52
SCHEMBL3066251 0.52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5686551-A DIHYDROXYSTILBENES, DIGLYCIDYL ETHERS THE DOW CHEMICAL COMPANY (US) 1997-11-11 US claimed
US-20230106477-A1 COMPOSITE, SLURRY COMPOSITION, FILM, AND METAL-CLAD LAMINATE ENEOS CORPORATION (JP) 2023-04-06 US disclosed
US-8436118-B2 Synthesis of acylarylenes and hyperbranched poly(aclarylene)s by metal-free cyclotrimerization of alkynes THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (CN) 2013-05-07 US disclosed
EP-1087263-B1 Photosensitive resin composition and patterning method HITACHI CHEM DUPONT MICROSYS (JP) 2012-07-04 EP disclosed
US-20100129757-A1 SYNTHESIS OF ACYLARYLENES AND HYPERBRANCHED POLY(ACLARYLENE)S BY METAL-FREE CYCLOTRIMERIZATION OF ALKYNES THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (CN) 2010-05-27 US disclosed
WO-2008151499-A1 SYNTHESIS OF ACYLARYLENES AND HYPERBRANCHED POLY(ACYLARYLENE)S BY METAL-FREE CYCLOTRIMERIZATION OF ALKYNES THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY (CN) 2008-12-18 WO disclosed
US-6773866-B2 AROMATIC POLYIMIDE PRECURSOR, WHEREIN A 10 MU M THICK POLYIMIDE FILM MADE FROM THE RESIN AND DEPOSITED ON A SILICON SUBSTRATE HAS LIGHT TRANSMITTANCE AT A WAVELENGTH OF 365 NM OF AT LEAST 1% AND A RESIDUAL STRESS OF AT MOST 25 MPA. HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. 2004-08-10 US disclosed
US-20020098444-A1 Photosensitive resin composition, patterning method, and electronic components HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. (US) 2002-07-25 US disclosed
US-6342333-B1 HEAT RESISTANT PHOTORESISTS; AROMATIC POLYIMIDE PRECURSORS HAVING AN INCREASED I-LINE TRANSPARENCY WHICH CAN BE IMIDIZED RESINS WITH LOW COEFFICIENT OF THERMAL EXPANSION AND LOW MECHANICAL STRESS ON SILICON WAFERS; HIGH RESOLUTION; AQUEOUS HITACHI CHEMICAL DUPONT MICROSYSTEMS, L.L.C. 2002-01-29 US disclosed
EP-1087263-A2 Photosensitive resin composition, pattering method, and electronic components Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2001-03-28 EP disclosed
US-4722809-A BLEND WITH HAOLGENATED AROMATIC POLYCARBONATE THE DOW CHEMICAL COMPANY (US) 1988-02-02 US disclosed
US-4649180-A HYDROLYTIC AND THERMAL STABILITY THE DOW CHEMICAL COMPANY (US) 1987-03-10 US disclosed
US-4338428-A Novel polyamides from ketene-aminals THE UPJOHN COMPANY (US) 1982-07-06 US disclosed
US-4178432-A THERMOPLASTIC MOLDING MATERIALS; HEAT AND OXIDATION RESISTANCE THE UPJOHN COMPANY (US) 1979-12-11 US disclosed
US-4115372-A SOLVENT SOLUBLE, INJECTION MOLDABLE THE UPJOHN COMPANY (US) 1978-09-19 US disclosed
US-4076537-A Light-sensitive materials containing organo tellurium or selenium compounds and sensitizers FUJI PHOTO FILM CO., LTD. (JA) 1978-02-28 US disclosed
US-4076530-A Dry photographic copying method for producing Te images FUJI PHOTO FILM CO., LTD. (JA) 1978-02-28 US disclosed
US-4072665-A Polyamide from arylene diamine, isophthalic acid and alkylene dicarboxylic acid THE UPJOHN COMPANY (US) 1978-02-07 US disclosed
US-4065441-A Copolyamide from arylene diamine and mixture of alkylene dicarboxylic acids THE UPJOHN COMPANY (US) 1977-12-27 US disclosed
US-4062685-A ORGANO-TELLURIUM COMPOUND FUJI PHOTO FILM CO., LTD. (JA) 1977-12-13 US disclosed