⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28408736 | 0.87 | — | — | |
| SCHEMBL28722344 | 0.87 | — | — | |
| SCHEMBL8839049 | 0.82 | — | — | |
| SCHEMBL8839213 | 0.82 | — | — | |
| SCHEMBL29352728 | 0.82 | — | — | |
| SCHEMBL8942280 | 0.82 | — | — | |
| SCHEMBL5498750 | 0.82 | — | — | |
| SCHEMBL302451 | 0.82 | — | — | |
| SCHEMBL249683 | 0.82 | — | — | |
| SCHEMBL28673941 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110198624-B | Heat-insulation heat-conduction wave-absorbing material and preparation method thereof | 浙江康廷电子科技有限公司 | 2021-07-13 | — | — | CN | claimed |
| CN-211199100-U | Heat-insulation heat-conduction wave-absorbing material | 浙江康廷电子科技有限公司 | 2020-08-07 | — | — | CN | claimed |
| CN-211199101-U | Heat-conducting wave-absorbing material | 浙江康廷电子科技有限公司 | 2020-08-07 | — | — | CN | claimed |
| CN-211210360-U | Heat-insulation wave-absorbing material | 浙江康廷电子科技有限公司 | 2020-08-07 | — | — | CN | claimed |
| CN-120644247-A | Preparation method of metal-supported aluminum-based catalyst and application of metal-supported aluminum-based catalyst in nitrifying wastewater treatment | 万华化学(福建)异氰酸酯有限公司 | 2025-09-16 | — | — | CN | disclosed |
| CN-216873734-U | Sign radiation protection membrane and circuit board | 广州方邦电子股份有限公司 | 2022-07-01 | — | — | CN | disclosed |
| CN-110198624-B | Heat-insulation heat-conduction wave-absorbing material and preparation method thereof | 浙江康廷电子科技有限公司 | 2021-07-13 | — | — | CN | disclosed |
| CN-213357448-U | Conductive adhesive tape | 浙江康廷电子科技有限公司 | 2021-06-04 | — | — | CN | disclosed |
| CN-211199100-U | Heat-insulation heat-conduction wave-absorbing material | 浙江康廷电子科技有限公司 | 2020-08-07 | — | — | CN | disclosed |
| CN-211210360-U | Heat-insulation wave-absorbing material | 浙江康廷电子科技有限公司 | 2020-08-07 | — | — | CN | disclosed |
| CN-211199101-U | Heat-conducting wave-absorbing material | 浙江康廷电子科技有限公司 | 2020-08-07 | — | — | CN | disclosed |