Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BID | P55957 | 5/20 | 0.42 |
| ▸ | MCL1 | Q07820 | 5/20 | 0.42 |
| ▸ | BCL2L1 | Q07817 | 4/20 | 0.42 |
| ▸ | BAK1 | Q16611 | 4/20 | 0.42 |
| ▸ | KAT8 | Q9H7Z6 | 3/20 | 0.42 |
| ▸ | SAE1 | Q9UBE0 | 2/20 | 0.42 |
| ▸ | EP300 | Q09472 | 2/20 | 0.42 |
| ▸ | KAT5 | Q92993 | 2/20 | 0.42 |
| ▸ | PPARG | P37231 | 1/20 | 0.42 |
| ▸ | PPARA | Q07869 | 1/20 | 0.42 |
| ▸ | KAT2A | Q92830 | 1/20 | 0.42 |
| ▸ | KAT2B | Q92831 | 1/20 | 0.42 |
| ▸ | F7 | P08709 | 3/20 | 0.40 |
| ▸ | F3 | P13726 | 3/20 | 0.40 |
| ▸ | MMP2 | P08253 | 2/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.40 |
| ▸ | MAPT | P10636 | 1/20 | 0.40 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.40 |
| ▸ | ECE1 | P42892 | 1/20 | 0.40 |
| ▸ | SGMS1 | Q86VZ5 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10719842 | 0.91 | BID (0.49) | BIDMCL1BCL2L1BAK1KAT8 | |
| SCHEMBL528716 | 0.91 | BID (0.49) | BIDMCL1BCL2L1BAK1KAT8 | |
| Ammonia Solution, Strong SCHEMBL29482610 | 0.90 | BID (0.48) | BIDMCL1BCL2L1BAK1KAT8 | |
| Ammonia Solution, Strong SCHEMBL29482609 | 0.90 | BID (0.48) | BIDMCL1BCL2L1BAK1KAT8 | |
| SCHEMBL627285 | 0.89 | BID (0.47) | BIDMCL1BCL2L1BAK1KAT8 | |
| Formaldehyde SCHEMBL28431260 | 0.88 | BID (0.50) | BIDMCL1BCL2L1BAK1KAT8 | |
| Oxirane SCHEMBL10719744 | 0.85 | BID (0.44) | BIDMCL1BCL2L1BAK1KAT8 | |
| SCHEMBL8518967 | 0.80 | BID (0.52) | BIDMCL1BCL2L1BAK1KAT8 | |
| SCHEMBL8583416 | 0.80 | BID (0.52) | BIDMCL1BCL2L1BAK1KAT8 | |
| SCHEMBL84570 | 0.78 | BID (0.50) | BIDMCL1BCL2L1BAK1KAT8 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111732936-A | Environment-friendly dust suppressant, preparation method and application thereof | 山东广兴环保科技有限公司 | 2020-10-02 | — | — | CN | claimed |
| CN-111621221-A | Water-based release coating for improving aluminum plating transfer effect of OPP (oriented polypropylene) film and preparation method thereof | 中山市博海精细化工有限公司 | 2020-09-04 | — | — | CN | claimed |
| CN-111590241-A | Low-temperature environment-friendly multi-element alloy soldering paste and preparation method thereof | 中山翰华锡业有限公司 | 2020-08-28 | — | — | CN | claimed |
| CN-117884325-A | Method for reducing gram weight of polyhydroxyalkanoate aqueous coating while maintaining barrier property and application thereof | 北京微构工场生物技术有限公司 | 2024-04-16 | — | — | CN | disclosed |
| CN-114806270-A | Water-based gloss oil composition, water-based gloss oil and application of water-based gloss oil in medicine packaging | 北京金印联国际供应链管理有限公司 | 2022-07-29 | — | — | CN | disclosed |
| CN-113584943-A | Oil-proof water-based heat-sealing coating applied to paper food packaging material and preparation method and use method thereof | 广东博海化工科技有限公司 | 2021-11-02 | — | — | CN | disclosed |
| CN-113430861-A | Waterproof water-based heat-sealing coating applied to paper food packaging material and preparation method and application method thereof | 广东博海化工科技有限公司 | 2021-09-24 | — | — | CN | disclosed |
| CN-111732936-A | Environment-friendly dust suppressant, preparation method and application thereof | 山东广兴环保科技有限公司 | 2020-10-02 | — | — | CN | disclosed |
| CN-111621221-A | Water-based release coating for improving aluminum plating transfer effect of OPP (oriented polypropylene) film and preparation method thereof | 中山市博海精细化工有限公司 | 2020-09-04 | — | — | CN | disclosed |
| CN-111590241-A | Low-temperature environment-friendly multi-element alloy soldering paste and preparation method thereof | 中山翰华锡业有限公司 | 2020-08-28 | — | — | CN | disclosed |