SCHEMBL28489448

SCHEMBL28489448

[AlH3].[Ni].[SnH2].[Zn]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28185871 0.89
SCHEMBL1696951 0.87
SCHEMBL28573168 0.87
SCHEMBL9003701 0.87
SCHEMBL119106 0.87
SCHEMBL27807266 0.87
SCHEMBL17353498 0.82
SCHEMBL23834440 0.75
SCHEMBL34963 0.75
SCHEMBL36688 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111809034-B Method for manufacturing automobile plate spring 四川丰元机械制造有限公司 2022-02-01 CN claimed
CN-111809034-A Method for manufacturing automobile plate spring 四川丰元机械制造有限公司 2020-10-23 CN claimed
CN-112296550-B Zinc-based high-temperature lead-free soldering tin and production method thereof 好利来(厦门)电路保护科技有限公司 2022-07-26 CN disclosed
CN-111809034-B Method for manufacturing automobile plate spring 四川丰元机械制造有限公司 2022-02-01 CN disclosed
CN-112296550-A Zinc-based high-temperature lead-free soldering tin and production method thereof 好利来(厦门)电路保护科技有限公司 2021-02-02 CN disclosed
CN-111809034-A Method for manufacturing automobile plate spring 四川丰元机械制造有限公司 2020-10-23 CN disclosed