SCHEMBL28530241

SCHEMBL28530241

C=C(CCCC(N)=O)C(=C)C(=C)C(=C)C(=C)C(=C)C(N)=O

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9989174 1.00 TDP1 (0.31) TDP1
SCHEMBL277731 0.95 MEN1 (0.32) TDP1
SCHEMBL8917916 0.95 MEN1 (0.32) TDP1
SCHEMBL28895644 0.93 SOAT1 (0.35)
SCHEMBL21858387 0.93 SOAT1 (0.35)
SCHEMBL22551201 0.93 SOAT1 (0.35)
SCHEMBL22209254 0.93 SOAT1 (0.35)
SCHEMBL17870571 0.93 SOAT1 (0.35)
SCHEMBL15520904 0.93 SOAT1 (0.35)
SCHEMBL251231 0.88 TDP1 (0.32) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112584997-B Molding apparatus, molding method, and method for manufacturing molded product 三菱瓦斯化学株式会社 2022-11-25 CN disclosed
CN-112225944-B LDS (laser direct structuring) additive with good dispersibility, LDS material containing additive and application 中国石油化工股份有限公司 2022-07-12 CN disclosed
CN-114616287-A Polyamide resin composition and molded article comprising same 尤尼吉可株式会社 2022-06-10 CN disclosed
CN-112225944-A LDS (laser direct structuring) additive with good dispersibility, LDS material containing additive and application 中国石油化工股份有限公司 2021-01-15 CN disclosed
CN-112226081-A Laser-sensitized resin composition, and preparation method and application thereof 中国石油化工股份有限公司 2021-01-15 CN disclosed