SCHEMBL28564909

SCHEMBL28564909

CCC(C)OC(C)COC(C)COC(C)CO

nearest known ligand 0.35

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4469350 0.98 TDP1 (0.32) TDP1
SCHEMBL4898614 0.90 TDP1 (0.48) TDP1
SCHEMBL1476210 0.86 TDP1 (0.35) TDP1
SCHEMBL15170 0.86 MAPK1 (0.33) TDP1
SCHEMBL1476195 0.86 TDP1 (0.35) TDP1
SCHEMBL32678899 0.85 TDP1 (0.34) TDP1
SCHEMBL32678901 0.85 TDP1 (0.34) TDP1
SCHEMBL1477001 0.84 MAPK1 (0.35) TDP1
SCHEMBL29908140 0.83 TSHR (0.38) TDP1
SCHEMBL32678920 0.83 TDP1 (0.31) TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122070591-A Conductive paste 昭荣化学工业株式会社 2026-05-19 CN disclosed
EP-4700824-A1 LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDED STRUCTURE Daicel Corporation (JP) 2026-02-25 EP disclosed
WO-2025100356-A1 CONDUCTIVE PASTE 昭栄化学工業株式会社 2025-05-15 WO disclosed
CN-108779419-B Cleaning agent composition for electronic material, cleaning agent stock solution, and method for cleaning electronic material 荒川化学工业株式会社 2021-04-20 CN disclosed