Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTT | P42858 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2954951 | 0.88 | AGL (0.31) | — | |
| SCHEMBL2869742 | 0.80 | — | — | |
| SCHEMBL2866919 | 0.76 | — | — | |
| SCHEMBL2869887 | 0.76 | GBA1 (0.30) | — | |
| SCHEMBL2869473 | 0.74 | POLB (0.31) | — | |
| SCHEMBL2860262 | 0.74 | — | — | |
| SCHEMBL2865309 | 0.74 | HTT (0.33) | HTT | |
| SCHEMBL3457521 | 0.67 | — | — | |
| SCHEMBL2866631 | 0.65 | — | — | |
| SCHEMBL5878639 | 0.65 | GBA2 (0.36) | HTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12466956-B2 | Electroconductive resin composition and molded article of same | DENKA COMPANY LIMITED (JP) | 2025-11-11 | — | — | US | disclosed |
| WO-2023189133-A1 | CONDUCTIVE RESIN COMPOSITION | デンカ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| CN-112601786-B | Conductive resin composition and molded article thereof | 电化株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-20220392373-A1 | MUCOSAL TISSUE MODEL | DENKA COMPANY LIMITED (JP) | 2022-12-08 | — | — | US | disclosed |
| EP-4083969-A1 | MUCOSAL TISSUE MODEL | Denka Company Limited (JP) | 2022-11-02 | — | — | EP | disclosed |
| EP-3845600-B1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LTD (JP) | 2022-10-26 | — | — | EP | disclosed |
| CN-114787895-A | Mucosal tissue model | 电化株式会社 | 2022-07-22 | — | — | CN | disclosed |
| US-20210246314-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LIMITED (JP) | 2021-08-12 | — | — | US | disclosed |
| EP-3845600-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | Denka Company Limited (JP) | 2021-07-07 | — | — | EP | disclosed |
| CN-112601786-A | Conductive resin composition and molded article thereof | 电化株式会社 | 2021-04-02 | — | — | CN | disclosed |
| US-20080094777-A1 | Electric double layer capacitor | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-04-24 | — | — | US | disclosed |
| EP-1905740-A1 | ELECTRIC DOUBLE LAYER CAPACITOR | Sumitomo Chemical Company, Limited (JP) | 2008-04-02 | — | — | EP | disclosed |
| EP-1876611-A1 | ELECTRIC DOUBLE LAYER CAPACITOR | Sumitomo Chemical Company, Limited (JP) | 2008-01-09 | — | — | EP | disclosed |
| US-20070269987-A1 | Polishing Liquid for Cmp Process and Polishing Method | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2007-11-22 | — | — | US | disclosed |
| CN-1302021-C | Non-aqueous absorbent and use thereof | SANYO CHEMICAL IND LTD (JP) | 2007-02-28 | — | — | CN | disclosed |
| EP-1705740-A1 | FUEL FOR FUEL CELL, FUEL CELL AND APPLICATION THEREOF | Kurita Water Industries Ltd. (JP) | 2006-09-27 | — | — | EP | disclosed |
| EP-1628334-A1 | POLISHING LIQUID FOR CMP PROCESS AND POLISHING METHOD | SANYO CHEMICAL INDUSTRIES LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050136247-A1 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2005-06-23 | — | — | US | disclosed |
| CN-1610703-A | Non-aqueous absorbent and use thereof | SANYO CHEMICAL IND LTD (JP) | 2005-04-27 | — | — | CN | disclosed |
| EP-1462460-A1 | NON-AQUEOUS ABSORBENT AND USE THEREOF | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-09-29 | — | — | EP | disclosed |