SCHEMBL28675124

SCHEMBL28675124

C[SiH2]OCCOCc1ccccc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.54
NAAA Q02083 1/20 0.46
TDP1 Q9NUW8 2/20 0.42
L3MBTL1 Q9Y468 2/20 0.42
ALDH1A1 P00352 2/20 0.41
LTA4H P09960 1/20 0.40
IDO1 P14902 1/20 0.40
AGXT P21549 1/20 0.39
HTT P42858 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
HRH4 Q9H3N8 1/20 0.38
HRH3 Q9Y5N1 1/20 0.38
CA1 P00915 2/20 0.38
CA2 P00918 2/20 0.38
CA7 P43166 2/20 0.38
CA9 Q16790 2/20 0.38
KDM4E B2RXH2 1/20 0.38
POLB P06746 1/20 0.38
MAPT P10636 1/20 0.37
MAPK1 P28482 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28693706 0.89 TSHR (0.50) TSHRNAAATDP1L3MBTL1ALDH1A1
SCHEMBL1991359 0.82 TSHR (0.78) TSHRNAAATDP1L3MBTL1LTA4H
SCHEMBL28647175 0.81 TSHR (0.50) TSHRNAAATDP1L3MBTL1ALDH1A1
SCHEMBL710880 0.81 TSHR (0.52) TSHRTDP1L3MBTL1ALDH1A1LTA4H
SCHEMBL4608747 0.80 TSHR (0.74) TSHRNAAATDP1L3MBTL1LTA4H
SCHEMBL10895400 0.80 TSHR (0.74) TSHRNAAATDP1L3MBTL1LTA4H
SCHEMBL26189828 0.80 TSHR (0.74) TSHRNAAATDP1L3MBTL1LTA4H
SCHEMBL27710140 0.80 TSHR (0.74) TSHRNAAATDP1L3MBTL1LTA4H
SCHEMBL9505432 0.80 TSHR (0.74) TSHRNAAATDP1L3MBTL1LTA4H
SCHEMBL3701483 0.80 TSHR (0.74) TSHRNAAATDP1L3MBTL1LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
CN-110249004-B Polyimide precursor composition 东京应化工业株式会社 2022-07-19 CN disclosed
CN-108389512-B Laminate, flexible device, and method for producing laminate 东京应化工业株式会社 2022-04-15 CN disclosed
WO-2022054912-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE 三菱ケミカル株式会社 2022-03-17 WO disclosed
CN-108250754-B Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device 东京应化工业株式会社 2022-01-25 CN disclosed