SCHEMBL2869057

SCHEMBL2869057

CC1N(C)CCC(CO)N1C

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
CYP1A2 P05177 1/20 0.31
GBA1 P04062 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5095411 0.83
SCHEMBL1898393 0.80 CYP1A2 (0.31) CYP1A2
SCHEMBL13132243 0.79
SCHEMBL12210895 0.79
SCHEMBL13700634 0.79
SCHEMBL2750123 0.77 GAA (0.34)
SCHEMBL5097894 0.76 TSHR (0.37)
SCHEMBL5095413 0.76
SCHEMBL2856694 0.74 MGAM (0.30)
SCHEMBL8313737 0.73 MGAM (0.38) POLBL3MBTL1CYP1A2GBA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12466956-B2 Electroconductive resin composition and molded article of same DENKA COMPANY LIMITED (JP) 2025-11-11 US disclosed
WO-2023189133-A1 CONDUCTIVE RESIN COMPOSITION デンカ株式会社 2023-10-05 WO disclosed
CN-112601786-B Conductive resin composition and molded article thereof 电化株式会社 2023-05-05 CN disclosed
US-20220392373-A1 MUCOSAL TISSUE MODEL DENKA COMPANY LIMITED (JP) 2022-12-08 US disclosed
EP-4083969-A1 MUCOSAL TISSUE MODEL Denka Company Limited (JP) 2022-11-02 EP disclosed
EP-3845600-B1 ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME DENKA COMPANY LTD (JP) 2022-10-26 EP disclosed
CN-114787895-A Mucosal tissue model 电化株式会社 2022-07-22 CN disclosed
US-20210246314-A1 ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME DENKA COMPANY LIMITED (JP) 2021-08-12 US disclosed
EP-3845600-A1 ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME Denka Company Limited (JP) 2021-07-07 EP disclosed
CN-112601786-A Conductive resin composition and molded article thereof 电化株式会社 2021-04-02 CN disclosed
US-7470738-B2 Non-aqueous absorbent and use thereof SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2008-12-30 US disclosed
US-20080094777-A1 Electric double layer capacitor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2008-04-24 US disclosed
EP-1905740-A1 ELECTRIC DOUBLE LAYER CAPACITOR Sumitomo Chemical Company, Limited (JP) 2008-04-02 EP disclosed
EP-1876611-A1 ELECTRIC DOUBLE LAYER CAPACITOR Sumitomo Chemical Company, Limited (JP) 2008-01-09 EP disclosed
US-20070269987-A1 Polishing Liquid for Cmp Process and Polishing Method SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2007-11-22 US disclosed
EP-1808875-A1 ELECTROLYTE FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR UTILIZING THE SAME MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2007-07-18 EP disclosed
CN-1784770-A Polishing liquid for CMP process and polishing method SANYO CHEMICAL IND LTD (JP) 2006-06-07 CN disclosed
EP-1628334-A1 POLISHING LIQUID FOR CMP PROCESS AND POLISHING METHOD SANYO CHEMICAL INDUSTRIES LTD. (JP) 2006-02-22 EP disclosed
US-20050136247-A1 Non-aqueous absorbent and use thereof SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2005-06-23 US disclosed
EP-1462460-A1 NON-AQUEOUS ABSORBENT AND USE THEREOF SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-09-29 EP disclosed