Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CTDSP1 | Q9GZU7 | 2/20 | 0.37 |
| ▸ | POLB | P06746 | 1/20 | 0.37 |
| ▸ | APOBEC3A | P31941 | 1/20 | 0.37 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | HDAC8 | Q9BY41 | 3/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2869039 | 0.82 | POLB (0.31) | CTDSP1POLBAPOBEC3AAPOBEC3G | |
| SCHEMBL2856682 | 0.79 | CA1 (0.34) | — | |
| SCHEMBL2865198 | 0.79 | HDAC8 (0.36) | HDAC8 | |
| SCHEMBL2865888 | 0.76 | MEN1 (0.32) | — | |
| SCHEMBL486702 | 0.74 | CTDSP1 (0.35) | CTDSP1POLBAPOBEC3AAPOBEC3GMAPT | |
| Bromide SCHEMBL710393 | 0.70 | CA1 (0.39) | CTDSP1POLBAPOBEC3AAPOBEC3GMAPT | |
| SCHEMBL28672369 | 0.70 | — | — | |
| SCHEMBL22349239 | 0.70 | — | — | |
| SCHEMBL22349237 | 0.70 | — | — | |
| SCHEMBL16819126 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12466956-B2 | Electroconductive resin composition and molded article of same | DENKA COMPANY LIMITED (JP) | 2025-11-11 | — | — | US | disclosed |
| CN-112601786-B | Conductive resin composition and molded article thereof | 电化株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-20220392373-A1 | MUCOSAL TISSUE MODEL | DENKA COMPANY LIMITED (JP) | 2022-12-08 | — | — | US | disclosed |
| EP-4083969-A1 | MUCOSAL TISSUE MODEL | Denka Company Limited (JP) | 2022-11-02 | — | — | EP | disclosed |
| EP-3845600-B1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LTD (JP) | 2022-10-26 | — | — | EP | disclosed |
| US-20210246314-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LIMITED (JP) | 2021-08-12 | — | — | US | disclosed |
| EP-3845600-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | Denka Company Limited (JP) | 2021-07-07 | — | — | EP | disclosed |
| CN-112601786-A | Conductive resin composition and molded article thereof | 电化株式会社 | 2021-04-02 | — | — | CN | disclosed |
| EP-2698802-B1 | Electrolytic capacitor | PANASONIC IP MAN CO LTD (JP) | 2018-05-16 | — | — | EP | disclosed |
| EP-1808875-B1 | ELECTROLYTE FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR UTILIZING THE SAME | PANASONIC IP MAN CO LTD (JP) | 2017-11-08 | — | — | EP | disclosed |
| US-7470738-B2 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2008-12-30 | — | — | US | disclosed |
| US-20080316679-A1 | Electrolytic Solution for Electrolytic Capacitor, and Electrolytic Capacitor Using the Same | PANASONIC CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080094777-A1 | Electric double layer capacitor | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-04-24 | — | — | US | disclosed |
| EP-1905740-A1 | ELECTRIC DOUBLE LAYER CAPACITOR | Sumitomo Chemical Company, Limited (JP) | 2008-04-02 | — | — | EP | disclosed |
| EP-1876611-A1 | ELECTRIC DOUBLE LAYER CAPACITOR | Sumitomo Chemical Company, Limited (JP) | 2008-01-09 | — | — | EP | disclosed |
| US-20070269987-A1 | Polishing Liquid for Cmp Process and Polishing Method | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2007-11-22 | — | — | US | disclosed |
| EP-1808875-A1 | ELECTROLYTE FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR UTILIZING THE SAME | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2007-07-18 | — | — | EP | disclosed |
| EP-1628334-A1 | POLISHING LIQUID FOR CMP PROCESS AND POLISHING METHOD | SANYO CHEMICAL INDUSTRIES LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050136247-A1 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2005-06-23 | — | — | US | disclosed |
| EP-1462460-A1 | NON-AQUEOUS ABSORBENT AND USE THEREOF | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-09-29 | — | — | EP | disclosed |