⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2869747 | 0.77 | — | — | |
| SCHEMBL2869041 | 0.77 | — | — | |
| SCHEMBL3220835 | 0.75 | — | — | |
| SCHEMBL2865200 | 0.75 | — | — | |
| SCHEMBL27703770 | 0.74 | — | — | |
| SCHEMBL27670931 | 0.71 | — | — | |
| SCHEMBL17186679 | 0.69 | — | — | |
| SCHEMBL2865705 | 0.69 | — | — | |
| SCHEMBL294565 | 0.69 | — | — | |
| SCHEMBL27745409 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12466956-B2 | Electroconductive resin composition and molded article of same | DENKA COMPANY LIMITED (JP) | 2025-11-11 | — | — | US | disclosed |
| WO-2023189133-A1 | CONDUCTIVE RESIN COMPOSITION | デンカ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| CN-112601786-B | Conductive resin composition and molded article thereof | 电化株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-20220392373-A1 | MUCOSAL TISSUE MODEL | DENKA COMPANY LIMITED (JP) | 2022-12-08 | — | — | US | disclosed |
| EP-4083969-A1 | MUCOSAL TISSUE MODEL | Denka Company Limited (JP) | 2022-11-02 | — | — | EP | disclosed |
| EP-3845600-B1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LTD (JP) | 2022-10-26 | — | — | EP | disclosed |
| US-20210246314-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LIMITED (JP) | 2021-08-12 | — | — | US | disclosed |
| EP-3845600-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | Denka Company Limited (JP) | 2021-07-07 | — | — | EP | disclosed |
| CN-112601786-A | Conductive resin composition and molded article thereof | 电化株式会社 | 2021-04-02 | — | — | CN | disclosed |
| EP-2698802-B1 | Electrolytic capacitor | PANASONIC IP MAN CO LTD (JP) | 2018-05-16 | — | — | EP | disclosed |
| US-20070269987-A1 | Polishing Liquid for Cmp Process and Polishing Method | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2007-11-22 | — | — | US | disclosed |
| CN-101057306-A | Electrolyte for electrolytic capacitor and electrolytic capacitor utilizing the same | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 2007-10-17 | — | — | CN | disclosed |
| EP-1808875-A1 | ELECTROLYTE FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR UTILIZING THE SAME | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2007-07-18 | — | — | EP | disclosed |
| CN-1302021-C | Non-aqueous absorbent and use thereof | SANYO CHEMICAL IND LTD (JP) | 2007-02-28 | — | — | CN | disclosed |
| CN-1784770-A | Polishing liquid for CMP process and polishing method | SANYO CHEMICAL IND LTD (JP) | 2006-06-07 | — | — | CN | disclosed |
| EP-1628334-A1 | POLISHING LIQUID FOR CMP PROCESS AND POLISHING METHOD | SANYO CHEMICAL INDUSTRIES LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050136247-A1 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2005-06-23 | — | — | US | disclosed |
| CN-1610703-A | Non-aqueous absorbent and use thereof | SANYO CHEMICAL IND LTD (JP) | 2005-04-27 | — | — | CN | disclosed |
| EP-1462460-A1 | NON-AQUEOUS ABSORBENT AND USE THEREOF | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-09-29 | — | — | EP | disclosed |
| CN-1381854-A | Electrolytic condenser | SANYO ELECTRIC IND LTD (JP) | 2002-11-27 | — | — | CN | disclosed |