SCHEMBL28778686

SCHEMBL28778686

CC(F)(c1ccc(C(=O)O)c(C(=O)O)c1)C(F)(F)F

nearest known ligand 0.50

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.50
ALDH1A1 P00352 3/20 0.47
KDM4E B2RXH2 2/20 0.47
HPGD P15428 2/20 0.47
HSD17B10 Q99714 2/20 0.47
USP2 O75604 1/20 0.45
CYP2C19 P33261 1/20 0.45
SORT1 Q99523 13/20 0.44
RXRB P28702 2/20 0.41
RXRA P19793 1/20 0.41
NR1H4 Q96RI1 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5178428 0.85 TDP1 (0.50) TDP1ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL12126484 0.84 TDP1 (0.49) TDP1ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL7093508 0.81 HSD17B10 (0.50) TDP1ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL109108 0.81 HSD17B10 (0.50) TDP1ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL29401067 0.81 HSD17B10 (0.50) TDP1ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL9492931 0.81 HSD17B10 (0.50) TDP1ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL1770132 0.81 HSD17B10 (0.50) TDP1ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL29441324 0.81 HSD17B10 (0.50) TDP1ALDH1A1KDM4EHPGDHSD17B10
SCHEMBL460066 0.80 KDM4E (0.69) ALDH1A1KDM4EHPGDHSD17B10USP2
SCHEMBL1356449 0.80 TDP1 (0.71) TDP1ALDH1A1KDM4EHPGDHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107312329-A Polyimide film and copper-clad laminate 新日铁住金化学株式会社 2017-11-03 CN disclosed
CN-103694701-B Polyamic acid composition, polyimide compositions, circuit substrate and its application method and layered product and its manufacture method 新日铁住金化学株式会社 2017-07-21 CN disclosed
CN-105339416-B Polyimides, resin film and metallic cover layered product 新日铁住金化学株式会社 2017-07-14 CN disclosed
CN-101484513-B Surface modification method for polyimide resin layer and method for producing metal-clad laminate NIPPON STEEL CHEMICAL CO 2013-05-29 CN disclosed
CN-101484513-A Surface modification method for polyimide resin layer and method for producing metal-clad laminate NIPPON STEEL CHEMICAL CO (JP) 2009-07-15 CN disclosed