SCHEMBL28834741

SCHEMBL28834741

CC(C)(C)COP=O.[AlH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27983024 0.97
SCHEMBL18243087 0.97
SCHEMBL21633515 0.92 CYP2C19 (0.39)
SCHEMBL2915858 0.72
SCHEMBL12758369 0.70
SCHEMBL17047664 0.69
SCHEMBL18243924 0.69
SCHEMBL27923310 0.69
SCHEMBL26910362 0.67
SCHEMBL17356394 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103975274-B Black-colored photosensitive resin composition and utilization thereof 株式会社钟化 2016-10-26 CN claimed
CN-116390855-A Resin composition, adhesive film, laminate with resin composition layer, laminate, and electromagnetic wave shielding film 东亚合成株式会社 2023-07-04 CN disclosed
CN-111801395-B Adhesive composition and laminate with adhesive layer using same 东亚合成株式会社 2023-06-23 CN disclosed
CN-115996999-A Adhesive composition 信越聚合物株式会社 2023-04-21 CN disclosed
CN-103492949-B Novel photosensitive polymer combination and utilization thereof 株式会社钟化 2016-12-28 CN disclosed
CN-103975274-B Black-colored photosensitive resin composition and utilization thereof 株式会社钟化 2016-10-26 CN disclosed