⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2351156 | 1.00 | — | — | |
| SCHEMBL4515965 | 1.00 | — | — | |
| SCHEMBL184221 | 1.00 | — | — | |
| SCHEMBL11022383 | 0.82 | — | — | |
| SCHEMBL17748148 | 0.82 | — | — | |
| SCHEMBL10704290 | 0.82 | — | — | |
| SCHEMBL34708 | 0.82 | — | — | |
| Water SCHEMBL4750610 | 0.82 | — | — | |
| SCHEMBL6473693 | 0.82 | — | — | |
| SCHEMBL17289247 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114822981-A | Method for preparing niobium three-aluminum superconducting wire by hot extrusion method | 西部超导材料科技股份有限公司 | 2022-07-29 | — | — | CN | claimed |
| CN-116631978-A | Semi-superconducting TSV (through silicon via) adapter plate structure and manufacturing method | 中国科学院上海微系统与信息技术研究所 | 2023-08-22 | — | — | CN | disclosed |
| CN-116631977-A | Full-superconducting TSV (through silicon via) adapter plate structure and manufacturing method | 中国科学院上海微系统与信息技术研究所 | 2023-08-22 | — | — | CN | disclosed |