SCHEMBL28857290

SCHEMBL28857290

OC1=C(O)C2=NC1=CC1=NC(=CC3=NC(=CC4=NC(=C2O)C(O)=C4c2ccccc2)C=C3)C=C1.[Ag]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27704066 0.99 — —
SCHEMBL27896679 0.98 — —
Methylene Chloride SCHEMBL28228425 0.94 — —
SCHEMBL8846964 0.84 — —
SCHEMBL27894506 0.83 — —
SCHEMBL27918999 0.83 — —
SCHEMBL7060717 0.82 — —
SCHEMBL27513464 0.76 — —
SCHEMBL226836 0.74 — —
SCHEMBL27206851 0.73 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115157811-A Irradiation-resistant hot melt adhesive double-layer heat-shrinkable sleeve for high-temperature vacuum and preparation method thereof 大连联合高分子材料有限公司 2022-10-11 — — CN claimed
CN-115157811-A Irradiation-resistant hot melt adhesive double-layer heat-shrinkable sleeve for high-temperature vacuum and preparation method thereof 大连联合高分子材料有限公司 2022-10-11 — — CN disclosed
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