⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29061547 | 0.84 | — | — | |
| SCHEMBL8942895 | 0.69 | — | — | |
| SCHEMBL3128156 | 0.69 | — | — | |
| SCHEMBL5003466 | 0.66 | — | — | |
| SCHEMBL28618386 | 0.66 | — | — | |
| SCHEMBL27600957 | 0.65 | — | — | |
| SCHEMBL25975572 | 0.65 | — | — | |
| SCHEMBL27437375 | 0.65 | — | — | |
| SCHEMBL28983772 | 0.64 | — | — | |
| Ethane SCHEMBL28759109 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112673045-B | Use of salts as accelerators in epoxy resin compounds for chemical fastening | 喜利得股份公司 | 2024-04-02 | — | — | CN | disclosed |
| CN-112673043-B | Curing agent composition for epoxy resin mixtures, epoxy resin mixtures and multicomponent epoxy resin systems | 喜利得股份公司 | 2024-03-29 | — | — | CN | disclosed |
| CN-115175949-B | Curing agent composition for epoxy resin composition, epoxy resin composition and multicomponent epoxy resin system | 喜利得股份公司 | 2024-03-19 | — | — | CN | disclosed |
| CN-112673044-B | Curable composition for epoxy resin compound, epoxy resin compound and multicomponent epoxy resin system | 喜利得股份公司 | 2023-08-15 | — | — | CN | disclosed |
| CN-112739740-B | Curing agent composition for epoxy resin compounds, epoxy resin compounds and multicomponent epoxy resin systems | 喜利得股份公司 | 2023-07-28 | — | — | CN | disclosed |
| CN-115175949-A | Curing agent composition for epoxy resin compositions based on diaminomethylcyclohexane and 1, 3-cyclohexanedi (methylamine), epoxy resin composition and multi-component epoxy resin system | 喜利得股份公司 | 2022-10-11 | — | — | CN | disclosed |