Phosphoric Acid Monododecyl Ester

Phosphoric Acid Monododecyl Ester

SCHEMBL28901475

CCCCCCCCCCCCOP(=O)(O)O.CN(C)C

nearest known ligand 0.88

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Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
LPAR3 Q9UBY5 14/20 0.88
LPAR2 Q9HBW0 10/20 0.88
LPAR1 Q92633 7/20 0.88
LPAR5 Q9H1C0 1/20 0.54
CYP3A4 P08684 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Trimethylammonium SCHEMBL27625006 1.00 LPAR3 (0.88) LPAR3LPAR2LPAR1LPAR5CYP3A4
Phosphoric Acid Monododecyl Ester SCHEMBL28901478 1.00 LPAR3 (0.88) LPAR3LPAR2LPAR1LPAR5CYP3A4
Phosphoric Acid Monotetradecyl Ester SCHEMBL28595278 1.00 LPAR3 (0.88) LPAR3LPAR2LPAR1LPAR5CYP3A4
Trimethylammonium SCHEMBL9189106 1.00 LPAR3 (0.88) LPAR3LPAR2LPAR1LPAR5CYP3A4
Hexadecyl Dihydrogen Phosphate SCHEMBL2809430 1.00 LPAR3 (0.88) LPAR3LPAR2LPAR1LPAR5CYP3A4
Trimethylammonium SCHEMBL28027117 1.00 LPAR3 (0.88) LPAR3LPAR2LPAR1LPAR5CYP3A4
Hexadecyl Dihydrogen Phosphate SCHEMBL27679691 0.98 LPAR3 (0.84) LPAR3LPAR2LPAR1LPAR5CYP3A4
Hexadecyl Dihydrogen Phosphate SCHEMBL28208207 0.98 LPAR3 (0.84) LPAR3LPAR2LPAR1LPAR5CYP3A4
Phosphoric Acid Monododecyl Ester SCHEMBL27830856 0.98 LPAR3 (0.84) LPAR3LPAR2LPAR1LPAR5CYP3A4
Phosphoric Acid Monododecyl Ester SCHEMBL28481088 0.96 LPAR3 (0.95) LPAR3LPAR2LPAR1LPAR5CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115279768-A Stereoisomer of epoxy compound, curable composition containing same, and cured product obtained by curing curable composition 引能仕株式会社 2022-11-01 CN disclosed