Iodide

Iodide

SCHEMBL28977658

C=Cc1ccc(C[n+]2ccn(C)c2)cc1.[I-]

nearest known ligand 0.43

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHECHRM1CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNG

The experimentally established mechanism targets of Iodide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ACHE known ✓ P22303 1/20 0.31
CA1 P00915 3/20 0.43
CA2 P00918 2/20 0.43
NT5E P21589 1/20 0.40
HDAC8 Q9BY41 1/20 0.35
XDH P47989 1/20 0.35
ALDH1A1 P00352 1/20 0.34
KDM4A O75164 2/20 0.34
KDM2A Q9Y2K7 2/20 0.34
CHKA P35790 2/20 0.31
BCHE P06276 1/20 0.31
POLB P06746 1/20 0.30
MAPT P10636 2/20 0.30
TP53 P04637 1/20 0.30
THRB P10828 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2521019 0.98 CA1 (0.44) CA1CA2NT5EHDAC8XDH
Hydrochloric Acid SCHEMBL2939455 0.97 CA1 (0.46) CA1CA2NT5EHDAC8XDH
SCHEMBL2953223 0.93 CA1 (0.41) CA1CA2NT5EHDAC8XDH
SCHEMBL28977661 0.93 CA1 (0.41) CA1CA2NT5EHDAC8XDH
Sulfuric Acid SCHEMBL30240025 0.90 CA1 (0.39) CA1CA2NT5EHDAC8XDH
SCHEMBL30070922 0.90 CA1 (0.39) CA1CA2NT5EHDAC8XDH
SCHEMBL29151749 0.89 CA1 (0.39) CA1CA2NT5EHDAC8XDH
Acetic Acid SCHEMBL30071029 0.89 CA1 (0.39) CA1CA2NT5EHDAC8XDH
Sulfuric Acid SCHEMBL30070932 0.89 TDP1 (0.41) CA1CA2NT5EHDAC8XDH
SCHEMBL12891425 0.85 CHKA (0.39) NT5ECHKABCHEACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115867586-A Electrochemically debondable adhesive compositions 汉高股份有限及两合公司 2023-03-28 CN disclosed