SCHEMBL2897980

SCHEMBL2897980

CC[Si](OC)(OC)C1CCC2OC2C1

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
PPM1B O75688 2/20 0.31
PTPN1 P18031 2/20 0.31
PPP1CC P36873 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21829135 0.86 PPM1B (0.31) PPM1BPTPN1PPP1CC
SCHEMBL2893443 0.84 PPM1B (0.30) PPM1BPTPN1PPP1CC
SCHEMBL3742134 0.78 PPM1B (0.34) PPM1BPTPN1PPP1CC
SCHEMBL208007 0.76 PPM1B (0.33) PPM1BPTPN1PPP1CC
SCHEMBL3741983 0.76 PPM1B (0.33) PPM1BPTPN1PPP1CC
Water SCHEMBL28266890 0.75
SCHEMBL7061876 0.74
SCHEMBL23175170 0.73
SCHEMBL3744193 0.73 PPM1B (0.33) PPM1BPTPN1PPP1CC
SCHEMBL28226378 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250154325-A1 VANILLIC ACID-BASED ORGANIC-INORGANIC COMPOUND, CURABLE COMPOSITION, AND PRODUCTION METHOD THEREOF ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) 2025-05-15 US claimed
CN-117186407-A Organic-inorganic composite, method for preparing the same, and curable composition comprising the same 韩国电子通信研究院 2023-12-08 CN claimed
US-20230391956-A1 SILYL ETHER ISOHEXIDE-BASED ORGANIC-INORGANIC COMPOUND, METHOD FOR PREPARING THE SAME, AND CURABLE COMPOSITION CONTAINING THE SAME ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) 2023-12-07 US claimed
US-10858539-B2 Siloxane hard-coating resin composition KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2020-12-08 US claimed
US-20180215949-A1 SILOXANE HARD-COATING RESIN COMPOSITION KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2018-08-02 US claimed
US-20250154325-A1 VANILLIC ACID-BASED ORGANIC-INORGANIC COMPOUND, CURABLE COMPOSITION, AND PRODUCTION METHOD THEREOF ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) 2025-05-15 US disclosed
CN-117186407-A Organic-inorganic composite, method for preparing the same, and curable composition comprising the same 韩国电子通信研究院 2023-12-08 CN disclosed
US-20230391956-A1 SILYL ETHER ISOHEXIDE-BASED ORGANIC-INORGANIC COMPOUND, METHOD FOR PREPARING THE SAME, AND CURABLE COMPOSITION CONTAINING THE SAME ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) 2023-12-07 US disclosed
CN-115003759-B Resin composition, method for producing same, and multicomponent curable resin composition 株式会社钟化 2023-12-01 CN disclosed
CN-116917368-A Curable resin composition and use thereof 株式会社钟化 2023-10-20 CN disclosed
CN-114008113-B Resin composition, method for producing same, and multicomponent curable resin composition 株式会社钟化 2023-05-02 CN disclosed
WO-2021145064-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-COMPONENT CURABLE RESIN COMPOSITION 株式会社カネカ 2021-07-22 WO disclosed
US-6159389-A Polyether copolymer and crosslinked solid polymer electrolyte DAISO CO., LTD. (JP) 2000-12-12 US disclosed
EP-1055687-A2 Emulsion and process for producing the same CLARIANT INTERNATIONAL LTD. (CH) 2000-11-29 EP disclosed
EP-1043372-A1 COATING COMPOSITION Clariant International Ltd. (CH) 2000-10-11 EP disclosed
EP-0994143-A1 Solid polymer electrolyte and use thereof DAISO CO., LTD. (JP) 2000-04-19 EP disclosed
EP-0945476-A1 Polyether copolymer and crosslinked solid polymer electrolyte DAISO CO., LTD. (JP) 1999-09-29 EP disclosed
EP-0897941-A1 CROSS-LINKED SOLID POLYELECTROLYTE AND USE THEREOF DAISO CO., LTD. (JP) 1999-02-24 EP disclosed
EP-0885913-A1 COPOLYETHER AND SOLID POLYMER ELECTROLYTE DAISO CO., LTD. (JP) 1998-12-23 EP disclosed
EP-0856538-A1 SOLID POLYELECTROLYTE DAISO CO., LTD. (JP) 1998-08-05 EP disclosed