SCHEMBL29037211

SCHEMBL29037211

CCCCCCCC(=O)CC1([SiH3])CCCCO1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 2/20 0.39
MAPT P10636 1/20 0.39
PTPN1 P18031 3/20 0.37
ACP1 P24666 1/20 0.37
CDC25B P30305 1/20 0.37
HAO1 Q9UJM8 1/20 0.36
CES2 O00748 3/20 0.35
CES1 P23141 3/20 0.35
GPR84 Q9NQS5 6/20 0.34
PPARG P37231 6/20 0.34
PPARD Q03181 6/20 0.34
PPARA Q07869 6/20 0.34
HDAC11 Q96DB2 5/20 0.34
TSHR P16473 4/20 0.34
ALDH1A1 P00352 2/20 0.34
TLR2 O60603 2/20 0.34
TDP1 Q9NUW8 2/20 0.34
FABP4 P15090 2/20 0.34
SLC22A6 Q4U2R8 1/20 0.34
SLC22A8 Q8TCC7 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9472084 0.76 PTPN1 (0.33) PTPN1ACP1CDC25BCES2CES1
SCHEMBL9237635 0.76 SCN2A (0.34)
SCHEMBL8610591 0.76 SCN2A (0.34)
SCHEMBL7951924 0.76 SCN2A (0.34)
SCHEMBL6517289 0.76 SCN2A (0.34)
SCHEMBL598640 0.76 SCN2A (0.34)
SCHEMBL8509327 0.76 SCN2A (0.34)
SCHEMBL2457674 0.76 SCN2A (0.34)
SCHEMBL4517435 0.76 SCN2A (0.34)
SCHEMBL176366 0.76 SCN2A (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116874967-A Composition, polymer composite article formed therewith, and method of making the same 美国陶氏有机硅公司 2023-10-13 CN disclosed
CN-111433275-B Composition, polymer composite article formed therewith, and method of making the same 美国陶氏有机硅公司 2023-07-25 CN disclosed
CN-111630103-B Composition, polymer composite article formed therewith, and method of making same 美国陶氏有机硅公司 2022-10-28 CN disclosed