SCHEMBL29038985

SCHEMBL29038985

CCCCC(C)CCc1ccc(C#N)cc1

nearest known ligand 0.57

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.57
HSD17B10 Q99714 1/20 0.57
CYP2A6 P11509 1/20 0.48
MMP2 P08253 1/20 0.42
MMP3 P08254 1/20 0.42
MMP12 P39900 1/20 0.42
MMP13 P45452 1/20 0.42
PTGES O14684 1/20 0.42
ALOX5 P09917 1/20 0.42
PPARG P37231 1/20 0.42
LOXL2 Q9Y4K0 2/20 0.42
KCNJ1 P48048 1/20 0.41
KCNH2 Q12809 1/20 0.41
CYP19A1 P11511 7/20 0.41
HRH3 Q9Y5N1 1/20 0.37
MGLL Q99685 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9498987 0.90 CYP2A6 (0.52) TSHRHSD17B10CYP2A6MMP12MMP13
SCHEMBL15046531 0.87 TSHR (0.57) TSHRHSD17B10CYP2A6MMP12MMP13
SCHEMBL11412039 0.85 TSHR (0.59) TSHRHSD17B10CYP2A6MMP2MMP3
SCHEMBL29038971 0.85 CYP2A6 (0.50) TSHRHSD17B10CYP2A6MMP2MMP3
SCHEMBL9144804 0.84 CYP2A6 (0.53) TSHRHSD17B10CYP2A6MMP12MMP13
SCHEMBL10534508 0.80 TSHR (0.57) TSHRHSD17B10CYP2A6MMP2MMP3
SCHEMBL10773411 0.80 TSHR (0.57) TSHRHSD17B10CYP2A6MMP2MMP3
SCHEMBL7658469 0.80 TSHR (0.53) TSHRHSD17B10CYP2A6LOXL2CYP19A1
SCHEMBL10658699 0.80 TSHR (0.49) TSHRHSD17B10CYP2A6MMP12MMP13
SCHEMBL3753968 0.80 HSD17B10 (0.76) TSHRHSD17B10CYP2A6LOXL2KCNJ1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118251445-A Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same 信越化学工业株式会社 2024-06-25 CN disclosed
CN-112236464-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2024-02-23 CN disclosed
CN-112204076-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2023-10-24 CN disclosed
CN-116813824-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-09-29 CN disclosed
CN-113646393-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-09-19 CN disclosed
CN-116490555-A Copper-clad laminate and printed circuit board 三菱瓦斯化学株式会社 2023-07-25 CN disclosed
CN-116490350-A Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2023-07-25 CN disclosed
CN-113348079-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-06-02 CN disclosed